公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2006 | Journal of Electronic Materials: Foreword | Suganuma K.; Chen S.-W.; Kao C.R.; Lee H.M.; Swenson D.J.; C. ROBERT KAO | Journal of Electronic Materials | 0 | 0 | |
2019 | Mechanical reliability assessment of Cu6Sn5 intermetallic compound and multilayer structures in Cu/Sn interconnects for 3D IC applications | Wu J.-Y.; Kao C.R.; Yang J.-M.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
1996 | A mechanism for reactive diffusion between Si single crystal and NbC powder compact | Kao C.R.; Woodford J.; Chang Y.A.; C. ROBERT KAO | Journal of Materials Research | |||
1990 | Model for micelle formation in copolymer/homopolymer blends | Kao C.R.; De La Cruz M.O.; C. ROBERT KAO | The Journal of Chemical Physics | |||
2016 | Novel Self-shrinking Mask for Sub-3 nm Pattern Fabrication | Yang P.-S.; Cheng P.-H.; Kao C.R.; C. ROBERT KAO ; MIIN-JANG CHEN | Scientific Reports | 9 | 12 | |
1993 | On the composition dependencies of self-diffusion coefficients in B2 intermetallic compounds | Kao C.R.; Chang Y.A.; C. ROBERT KAO | Intermetallics | |||
1993 | On the optimization of solution model parameter values of phases and the calculation of phase diagrams | Chen S.-L.; Zuo Y.; Kao C.R.; Chang Y.A.; C. ROBERT KAO | Calphad | |||
1996 | On the site preferences of ternary additions to triple defect B2 intermetallic compounds | Pike L.M.; Kao C.R.; Chen S.-L.; Chang Y.A.; C. ROBERT KAO | TMS Annual Meeting | |||
2019 | Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface | Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO | Scientific Reports | 8 | ||
2018 | Organic/inorganic interfacial microstructures achieved by fast atom beam bombardment and vacuum ultraviolet irradiation | Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | |||
2016 | Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates - A simulation study | Ke J.H.; Gao Y.; Kao C.R.; Wang Y.; C. ROBERT KAO | Acta Materialia | |||
1993 | Phase equilibria of the cu-in system I: Experimental investigation | Bolcavage A.; Chen S.W.; Kao C.R.; Chang Y.A.; Romig A.D.; C. ROBERT KAO | Journal of Phase Equilibria | |||
1993 | Phase equilibria of the cu-in system II: Thermodynamic assessment and calculation of phase diagram | Kao C.R.; Bolccwage A.; Chen S.-L.; Chen S.W.; Chang Y.A.; Romig A.D.; C. ROBERT KAO | Journal of Phase Equilibria | |||
1997 | Reactions of solid copper with pure liquid tin and liquid tin saturated with copper | Hayashi A.; Kao C.R.; Chang Y.A.; C. ROBERT KAO | Scripta Materialia | |||
1996 | Reactive diffusion between silicon and niobium carbide: Application to the in-situ synthesis of a silicon carbide-niobium disilicide composite | Kao C.R.; Woodford J.; Chang Y.A.; C. ROBERT KAO | TMS Annual Meeting | |||
2019 | Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits | Weng I.A.; Hung H.T.; Yang S.; Kao C.R.; Chen Y.H.; C. ROBERT KAO | Scripta Materialia | |||
2015 | Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing | Li C.C.; Drymiotis F.; Liao L.L.; Dai M.J.; Liu C.K.; Chen C.L.; Chen Y.Y.; Kao C.R.; Snyder G.J.; C. ROBERT KAO | Energy Conversion and Management | |||
1994 | Site preference of substitutional additions to triple-defect B2 intermetallic compounds | Kao C.R.; Pike L.M.; Chen S.-L.; Chang Y.A.; C. ROBERT KAO | Intermetallics | |||
2012 | Soldering reactions under space confinement for 3D IC applications | Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | 10 | 0 | |
2005 | Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton | Wu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Materials Research Society Symposium |