公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2018 | Analyses and design for electrochemical migration suppression by alloying indium into silver | Yang C.A.; Wu J.; Lee C.C.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | |||
2017 | Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint | Yang C.A.; Kao C.R.; Nishikawa H.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2018 | Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indium | Yang C.A.; Yang S.; Liu X.; Nishikawa H.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
2018 | High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications | Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2015 | Mechanism of volume shrinkage during reaction between Ni and Ag-doped Sn | Li C.C.; Ke J.H.; Yang C.A.; C. ROBERT KAO | Materials Letters | |||
2015 | Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications | Yu J.J.; Yang C.A.; Lin Y.F.; CHUN-HWAY HSUEH ; C. ROBERT KAO | Journal of Alloys and Compounds | |||
2016 | Study of Sintered Nano-Silver Die Attachment Materials Doped with Indium | Yang C.A.; C. ROBERT KAO | Electronic Components and Technology Conference |