公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2019 | Abnormal Cu3Sn growth through grain boundary penetration in space-confined Ni-Sn-Cu diffusion couples | Wang Y.W.; Zhu Z.X.; Shih W.L.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
2013 | Assembly of N type Bi2(Te, Se)3 thermoelectric modules by low temperature bonding | Li C.C.; Zhu Z.X.; Liao L.L.; Dai M.J.; Liu C.K.; C. ROBERT KAO | Science and Technology of Welding and Joining | |||
2016 | Au-Sn bonding material for the assembly of power integrated circuit module | Zhu Z.X.; Li C.C.; Liao L.L.; Liu C.K.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
2015 | Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique | Li C.C.; Hsu S.J.; Lee C.C.; Liao L.L.; Dai M.J.; Liu C.K.; Zhu Z.X.; Yang H.W.; Ke J.H.; Kao C.R.; Snyder G.J.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2017 | Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro joints | Yang H.W.; Wu J.Y.; Zhu Z.X.; C. ROBERT KAO | Materials Chemistry and Physics | |||
2017 | Grain Boundary Penetration of Various Types of Ni Layer by Molten Metals | Yang S.; Chang C.Y.; Zhu Z.X.; Lin Y.F.; C. ROBERT KAO | Journal of Electronic Materials | |||
2014 | Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow | Key Chung C.; Zhu Z.X.; C. ROBERT KAO | Journal of Electronic Materials | |||
2013 | Volume shrinkage induced by interfacial reactions in micro joints | Li C.C.; Zhu Z.X.; Chen M.H.; C. ROBERT KAO | International Symposium on Advanced Packaging Materials |