https://scholars.lib.ntu.edu.tw/handle/123456789/378007
Title: | Performance Comparison of Flip-Chip-Assembled 5-GHz 0.18-<formula formulatype="inline"> <tex Notation="TeX">$\\mu{\ m m}$</tex></formula> CMOS Power Amplifiers on Different Packaging Substrates | Authors: | Che-Chung Kuo Yao-Wen Hsu Wei-Chao Huang Huei Wang HSIN-CHIA LU |
Issue Date: | 2013 | Journal Volume: | 3 | Journal Issue: | 12 | Start page/Pages: | 2014--2021 | Source: | IEEE Transactions on Components, Packaging and Manufacturing Technology | URI: | http://scholars.lib.ntu.edu.tw/handle/123456789/378007 | DOI: | 10.1109/tcpmt.2013.2282295 |
Appears in Collections: | 電子工程學研究所 |
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