https://scholars.lib.ntu.edu.tw/handle/123456789/61404
Title: | A pplication of soft landing to the process control of chemical mechanical polishing | Authors: | Chiu, Jian-Bin Yu, Cheng-Ching Shen, Shih-Haur |
Keywords: | soft landing;minimum time problem;chemical mechanical polishing;damascene;STI process control | Issue Date: | 2003 | Publisher: | Taipei:National Taiwan University Dept Chem Engn | Start page/Pages: | - | Source: | Microelectronic Engineering 65(2003), 345–356 | Abstract: | In chemical mechanical polishing (CMP), a two-stage polishing strategy is often employed. A high removal rate (RR) is set at the initial stage, then a lower RR is employed to remove residual metal and extended to the over-polish stage. An analogy between the soft landing of a spacecraft and CMP operation is established and the CMP operation can be viewed as a minimum-time optimal control problem. Measurement uncertainties prevent direct implementation of bang-bang control law for the entire polishing process. Thus, a two-stage CMP operation procedure is devised to ensure robust operation while maintaining a high throughput. |
URI: | http://ntur.lib.ntu.edu.tw//handle/246246/2006111501244184 | Other Identifiers: | 246246/2006111501244184 |
Appears in Collections: | 化學工程學系 |
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