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Showing results 7 to 26 of 33
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Issue Date
Title
Author(s)
Source
scopus
WOS
Fulltext/Archive link
1997
Micromechanical Modeling of Creep Behavior in Particle-Reinforced Silicone-Rubber Composites
Chen, Chao-Hsun
; Cheng, Chaing-Ho
Journal of Applied Mechanics
1998
Micromechanics and apparent viscosities of non-Newtonian fluid suspensions
Chen, Chao-Hsun
; Cheng, Chaing-Ho
Mechanics of Materials
1995
Micromechanics and Creep Behavior of Fiber-Reinforced Polyether-Ether-Ketone Composites
Chen, Chao-Hsun
; Chang, Yi-Haw; Cheng, Chiang-Ho
Journal of Composite Materials
1996
Micromechanics of Nonlinear Behavior in Solid-Filled Mooney-Rivlin Rubber Specimen
Chen, Chao-Hsun
; Wu, Chien-Heng; Wang, Yuh-Chang; Cheng, Chiang-Ho
Journal of Propulsion and Power
1999
A Modified Rheological Model of Viscosities for BR/SBS Blends
Chu, Line-Hwa; Chiu, Wen-Yen
; Chen, Chao-Hsun
; Tseng, Hsieng-Cheng
Journal of Applied Polymer Science
1996
Secant Moduli of a Glass Bead-Reinforced Silicone Rubber Specimen
Chen, Chao-Hsun
; Cheng, Chaing-Ho
Journal of Composite Materials
1996
The stress intensity factors of regularly and singularly perturbed-interface cracks
Chen, Chao-Hsun
; Hsu, Jinhon
Mechanics of Materials
1997
The stress intensity factors of regularly perturbed-interface cracks of anisotropic bimaterials
Chen, Chao-Hsun
; Hsu, Jinhon
International Journal of Solids and Structures
1996
The stress intensity factors of slightly undulating interface cracks of bimaterials
Chen, Chao-Hsun
; Hsu, Jinhon
International Journal of Fracture
1995
三明治夾心板之破壞韌度量測
陳兆勛
1994
三明治夾心板之破壞韌度量測
陳兆勛
1999
三材料之熱應力分析
陳兆勛
1997
半導體封裝之應力分析(I)─子計畫三:半導體封裝之介面破壞分析
陳兆勛
1992
固體顆粒填充高分子基材之研究
陳兆勛
2005
應力下因表面能及彈性能變化造成孔洞變形之研究
陳兆勛
1994
接著劑之疲勞拉伸破壞行為
陳兆勛
1999
短纖強化塑膠射出成型品之微觀力學分析(I)
陳兆勛
2000
短纖強化塑膠射出成型品之微觀力學分析─熱傳導係數
陳兆勛
1997
總計畫
陳兆勛
1995
纖維橋結裂紋之微觀力學分析(II)
陳兆勛