公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2016 | Queue-based segmentation algorithm for refining depth maps in light field camera applications | Yi-Hsiang Chen; Nae-Chyun Chen; Yu-Hsiang Kao; Yu-Cheng Li; Yi-Chang Lu; YI-CHANG LU | IEEE Global Conference on Consumer Electronics | 1 | 0 | |
2021 | A Real Time Video Stabilizer Based on Feature Trajectories and Global Mesh Warping | Huang S.-J; Lin Y.-H; Weng C.-H; YI-CHANG LU | 2021 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2021 and 2021 IEEE Conference on Postgraduate Research in Microelectronics and Electronics, PRIMEASIA 2021 | 0 | 0 | |
2021 | RGB-NIR Demosaicking Using a Two-Phase Primal-Dual Algorithm with a Laplacian Guided Image Filter Prior | Duh W.-Y; Lin Y.-H; Lu Y.-C.; YI-CHANG LU | 2021 IEEE International Conference on Consumer Electronics-Asia, ICCE-Asia 2021 | 0 | 0 | |
2022 | Shadow Removal Through Learning-Based Region Matching and Mapping Function Optimization | Hsieh, Shih Wei; Yang, Chih Hsiang; YI-CHANG LU | Proceedings - IEEE International Conference on Multimedia and Expo | 1 | 0 | |
2010 | Signal/Power integrity modeling of high-speed memory modules using chip-package-board co-analysis | YI-CHANG LU ; TZONG-LIN WU ; HSIN-SHU CHEN ; RUEY-BEEI WU | IEEE Transactions on Electromagnetic Compatibility | | 24 | |
2016 | A special processor design for nucleotide basic local alignment search tool with a new banded two-hit method | Chih-Yu Chang; Yu-Cheng Li; Nae-Chyun Chen; Xiao-Xuan Huang; Yi-Chang Lu; YI-CHANG LU | IEEE Nordic Circuits and Systems Conference | 2 | 0 | |
2019 | A special-purpose processor for FFT-based digital refocusing using 4-D light field data | Chen, M.-R.; Liu, H.-W.; Lin, Y.-H.; Lu, Y.-C.; YI-CHANG LU | Proceedings - IEEE International Symposium on Circuits and Systems | 1 | 0 | |
2016 | Step Shift: a fast image segmentation algorithm and its hardware implementation for next-generation-sequencing fluorescence data | Xiao-Xuan Huang; Chun-Hsien Ho; Yu-Cheng Li; Nae-Chyun Chen; Yi-Chang Lu; YI-CHANG LU | IEEE Asia Pacific Conference on Circuits and Systems | 0 | 0 | |
2018 | Subpixel-level-accurate algorithm for removing double-layered reflections from a single image | Shih-Wei Hsieh; Yao-Cheng Yang; Chi-Ming Yeh; Sheng-Jui Huang; Yi-Chang Lu; YI-CHANG LU | IEEE International Conference on Image Processing | 1 | 0 | |
2013 | Test generation of path delay faults induced by defects in power TSV | Shih, C.-J.; Hsieh, S.-A.; Lu, Y.-C.; Li, J.C.-M.; Wu, T.-L.; TZONG-LIN WU ; YI-CHANG LU ; CHIEN-MO LI | Proceedings of the Asian Test Symposium | 2 | 0 | |
2014 | Testing of TSV-induced small delay faults for 3-D integrated circuits | Chun-Yi Kuo; Chi-Jih Shih; Yi-Chang Lu; James C.-M. Li; Krishnendu Chakrabarty; YI-CHANG LU ; CHIEN-MO LI | IEEE Trans. Very Large Scale Integration (VLSI) Systems | 17 | 13 | |
2012 | The effect of NBTI on 3D integrated circuits | Cheng-Hong Lin; Yi-Chang Lu; Chin-Khai Tang; Kuen-Yu Tsai; YI-CHANG LU ; KUEN-YU TSAI | Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE | 2 | 0 | |
2013 | Thermal coupling aware task migration using neighboring core search for many-core systems. | Mizunuma, Hitoshi; Lu, Yi-Chang; YI-CHANG LU ; CHIA-LIN YANG | 2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013, Hsinchu, Taiwan, April 22-24, 2013 | 8 | 0 | |
2011 | Thermal modeling and analysis for 3-D ICs with integrated microchannel cooling | Mizunuma, H.; Lu, Y.-C.; Yang, C.-L.; YI-CHANG LU ; CHIA-LIN YANG | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems | 46 | 46 | |
2011 | Thermal modeling and analysis for 3D-ICs with integrated microchannel cooling | Hitoshi Mizunuma; Yi-Chang Lu; Chia-Lin Yang; YI-CHANG LU | IEEE Trans. Computer-Aided Design of Integrated Circuits and Systems | | | |
2009 | Thermal modeling and device noise properties of 3D-SOI technology | Tze Wee Chen; Jung Hoon Chun; Yi-Chang Lu; Reza Navid; Wei Wang; Chang-Lee Chen; Robert W. Dutton; YI-CHANG LU | IEEE Trans. Electron Devices | 1 | 0 | |
2009 | Thermal Modeling and Device Noise Properties of Three-Dimensional–SOI Technology | Chen, Tze Wee; Chun, Jung Hoon; Lu, Yi-chang ; Navid, R.; Wang, Wei; Chen, Chang-Lee; Dutton, R.W. | IEEE Transactions on Electron Devices | | | |
2009 | Thermal modeling and device oise properties of three-dimensional-SOI technology | Chen, T.W.; Chun, J.-H.; Lu, Y.-C.; Navid, R.; Wang, W.; Chen, C.-L.; Dutton, R.W.; YI-CHANG LU | IEEE Transactions on Electron Devices | 3 | 1 | |
2009 | Thermal modeling for 3D-ICs with integrated microchannel cooling. | Mizunuma, Hitoshi; Yang, Chia-Lin; YI-CHANG LU ; CHIA-LIN YANG | 2009 International Conference on Computer-Aided Design, ICCAD 2009, San Jose, CA, USA, November 2-5, 2009 | 45 | 0 | |
2010 | Thermal-aware router-sharing architecture for 3D network-on-chip designs | Huang, Y.-R.; Pan, J.-H.; Lu, Y.-C.; YI-CHANG LU | IEEE Asia-Pacific Conference on Circuits and Systems, Proceedings, APCCAS | 6 | 0 | |