公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2008 | Fatigue life evaluation of ball grid array packages with Sn-Ag-Cu and rare-earth addition solder under cyclic bending test | Cheng, C.-Y.; Zhan, C.-J.; Chuang, T.-H.; TUNG-HAN CHUANG | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008 | | | |
2009 | First shell substitution effects on hyperbranched polymers formed from monomers A2 and B3 with end-capping molecules | Cheng, K.-C.; Chuang, T.-H.; Tsai, T.-H.; Guo, W.; Su, W.-F.; WEI-FANG SU | European Polymer Journal | | | |
2013 | Formation and growth of intermetallics in an annealing-twinned Ag-8Au-3Pd wire bonding package during reliability tests | Chuang, T.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2011 | Functional interaction of Heat Shock protein 90 and beclin 1 modulates toll-like receptor-mediated autophagy | LI-CHUNG HSU ; Xu, C.; Liu, J.; Hsu, L.-C.; Luo, Y.; Xiang, R.; Chuang, T.-H. | FASEB Journal | 77 | 73 | |
2013 | High performance Ag-Pd alloy wires for high frequency IC packages | Tsai, H.-H.; Chuang, T.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Lin, H.-J.; Chang, C.-C.; TUNG-HAN CHUANG | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | | | |
2006 | High performance midinfrared narrow-band plasmonic thermal emitter | Tsai, M.-W.; Chuang, T.-H.; Meng, C.-Y.; Chang, Y.-T.; SI-CHEN LEE | Applied Physics Letters | | | |
2014 | Improvement of bonding strength of a (Pb, Sn)Te-Cu contact manufactured in a low temperature SLID-bonding process | Chuang, T.-H.; Yeh, W.-T.; Chuang, C.-H.; Hwang, J.-D.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2006 | The improvement of polycrystalline silicon TFTs fabricated by employing periodic metal pads | Chang, H.-Y.; Meng, C.-Y.; Tsai, M.-W.; Yang, B.-C.; Chuang, T.-H.; SI-CHEN LEE | IEEE Transactions on Electron Devices | 2 | 2 | |
2020 | Improvement of Sn-3Ag-0.5Cu Soldered Joints Between Bi 0.5 Sb 1.5 Te 3 Thermoelectric Material and a Cu Electrode | Chuang, T.-H.; Hsu, S.-W.; Lin, Y.-C.; Yeh, W.-T.; Chen, C.-H.; Lee, P.-I.; Wu, P.-C.; Cheng, H.-P.; TUNG-HAN CHUANG | Journal of Electronic Materials | | 5 | |
2020 | Improving Performance of Nonvolatile Perovskite-Based Photomemory by Size Restrain of Perovskites Nanocrystals in the Hybrid Floating Gate | Yang, W.-C.; Chiang, Y.-C.; Lam, J.-Y.; Chuang, T.-H.; Ercan, E.; CHU-CHEN CHUEH ; WEN-CHANG CHEN | Advanced Electronic Materials | | 24 | |
2015 | Influence of glass transition temperature of underfill on the stress behavior and reliability of microjoints within a chip stacking architecture | Chang, J.-Y.; Huang, S.-Y.; Lee, C.-C.; Chuang, T.-H.; Chang, T.-C.; TUNG-HAN CHUANG | Journal of Electronic Packaging, Transactions of the ASME | | | |
2018 | The influence of oxygen flow ratio on the optoelectronic properties of p-type Ni<inf>1-x</inf>O films deposited by ion beam assisted sputtering | Sun, H.; Chen, S.-C.; Peng, W.-C.; Wen, C.-K.; Wang, X.; Chuang, T.-H.; TUNG-HAN CHUANG | Coatings | | | |
1997 | Influence of zr addition on the corrosion behavior of the Ni<inf>3</inf>AI intermetallic compounds | Chang, T.-T.; Chuang, T.-H.; TUNG-HAN CHUANG | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an | | | |
2009 | Inhibition of whisker growth on the surface of Sn-3Ag-0.5Cu-0.5Ce solder alloyed with Zn | Chuang, T.-H.; Lin, H.-J.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2012 | An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packaging | Tsai, H.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | | | |
2020 | Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip Packaging | Chen, C.-H.; Hsu, S.-W.; Chuang, T.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | 1 | |
2020 | Intermetallic Compounds at the Interfaces of Ag-Pd Alloy Stud Bumps with Al Pads | Chuang, T.-H.; Hsu, S.-W.; Chen, C.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | 6 | |
2006 | Intermetallic compounds formed during diffusion soldering of Au/Cu/Al <inf>2</inf>O<inf>3</inf> and Cu/Ti/Si with Sn/In interlayer | Chuang, T.-H.; Lin, H.-J.; Tsao, C.-W.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2006 | Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish | Chuang, T.-H.; Yen, S.-F.; Wu, H.-M.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2009 | Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish | Jain, C.-C.; Wang, S.-S.; Wu, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an | | | |