Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2014 | Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing | Huang T.C.; Yang T.L.; Ke J.H.; Hsueh C.H.; CHUN-HWAY HSUEH ; C. ROBERT KAO | Scripta Materialia | 55 | 52 | |
2015 | Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materials | Li C.C.; Drymiotis F.; Liao L.L.; Hung H.T.; Ke J.H.; Liu C.K.; Kao C.R.; Snyder G.J.; C. ROBERT KAO | Journal of Materials Chemistry C | |||
2015 | Mechanism of volume shrinkage during reaction between Ni and Ag-doped Sn | Li C.C.; Ke J.H.; Yang C.A.; C. ROBERT KAO | Materials Letters | |||
2015 | Microalloying effect of Si on mechanical properties of Ti based bulk metallic glass | Tsai P.H.; Hsu K.T.; Ke J.H.; Lin H.C.; Jang J.S.C.; Huang J.C.; HSIN-CHIH LIN | Materials Technology | |||
2016 | Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates - A simulation study | Ke J.H.; Gao Y.; Kao C.R.; Wang Y.; C. ROBERT KAO | Acta Materialia | |||
2014 | Phase field microelasticity model of dislocation climb: Methodology and applications | Ke J.H.; Boyne A.; Wang Y.; C. ROBERT KAO | Acta Materialia | |||
2013 | Serrated cathode dissolution under high current density: Morphology and root cause | Yang T.L.; Ke J.H.; Shih W.L.; Lai Y.S.; C. ROBERT KAO | Journal of Applied Physics | 6 | 6 |