Skip navigation
中文
English
DSpace
CRIS
首頁
單位
研究人員
研究成果檢索
分類瀏覽
單位
研究人員
研究成果檢索
學術出版
幫助
登入
中文
English
NTU Scholars
研究成果檢索
瀏覽 的方式: 作者
Lai Y.S.
或是輸入前幾個字:
跳到:
0-9
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
排序方式:
升冪
降冪
結果/頁面
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
作者/紀錄:
全部
1
5
10
15
20
25
30
35
40
45
50
顯示 1 到 7 筆資料,總共 7 筆
公開日期
標題
作者
來源出版物
scopus
WOS
全文
2011
Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing
Ke J.H.; Yang T.L.; Lai Y.S.; C. ROBERT KAO
Acta Materialia
54
52
2011
Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging
Chuang H.Y.; Chen W.M.; Shih W.L.; Lai Y.S.; C. ROBERT KAO
Electronic Components and Technology Conference
2006
Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration
Lin Y.L.; Lai Y.S.; Tsai C.M.; C. ROBERT KAO
Journal of Electronic Materials
31
27
2008
Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration
Lin Y.L.; Lai Y.S.; Lin Y.W.; C. ROBERT KAO
Journal of Electronic Materials
2009
Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substrates
CHIEN-CHENG CHANG
; Lin Y.W.; Lai Y.S.; C. ROBERT KAO
Journal of Electronic Materials
6
5
2011
Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding
Lu Y.H.; Wang Y.W.; Appelt B.K.; Lai Y.S.; C. ROBERT KAO
Electronic Components and Technology Conference
2013
Serrated cathode dissolution under high current density: Morphology and root cause
Yang T.L.; Ke J.H.; Shih W.L.; Lai Y.S.; C. ROBERT KAO
Journal of Applied Physics
6
6