公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2006 | In-situ observation of material migration in flip-chip solder joints under current stressing | Tsai C.M.; Lai Y.-S.; Lin Y.L.; Chang C.W.; C. ROBERT KAO | Journal of Electronic Materials | |||
2006 | Local melting induced by electromigration in flip-chip solder joints | Tsai C.M.; Lin Y.L.; Tsai J.Y.; Lai Y.I.-S.; C. ROBERT KAO | Journal of Electronic Materials | 61 | 58 | |
2002 | Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages | Lin Y.L.; Tsai J.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging 2002 | |||
2006 | Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates | Tsai J.Y.; Chang C.W.; Ho C.E.; Lin Y.L.; C. ROBERT KAO | Journal of Electronic Materials | 40 | 34 | |
1995 | Phenotypic and functional analysis of natural killer cells in systemic lupus erythematosus patients. | BOR-LUEN CHIANG ; Chen Y.C.; Wang C.R.; Lin Y.L.; Chou C.C.; Hsieh K.H. | Zhonghua Minguo xiao er ke yi xue hui za zhi [Journal]. Zhonghua Minguo xiao er ke yi xue hui | 5 | 0 | |
2022 | Population-based high-throughput toxicity screen of human iPSC-derived cardiomyocytes and neurons | Huang C.Y.; Nicholson M.W.; Wang J.Y.; Ting C.Y.; Tsai M.H.; Cheng Y.C.; Liu C.L.; Chan D.Z.H.; Lee Y.C.; Hsu C.C.; YU-HSIANG HSU ; Yang C.F.; Chang C.M.C.; Ruan S.C.; Lin P.J.; Lin J.H.; Chen L.L.; Hsieh M.L.; Cheng Y.Y.; WAN-TSENG HSU ; Lin Y.L.; Chen C.H.; Hsu Y.H.; Wu Y.T.; Hacker T.A.; Wu J.C.; Kamp T.J.; Hsieh P.C.H. | Cell Reports | 14 | 11 | |
2005 | Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations | Luo W.C.; Ho C.E.; Tsai J.Y.; Lin Y.L.; C. ROBERT KAO | Materials Science and Engineering A | |||
2002 | Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni | Ho C.E.; Lin Y.L.; C. ROBERT KAO | Chemistry of Materials | 77 | 73 | |
2008 | Tin whisker growth induced by high electron current density | Lin Y.W.; Lai Y.-S.; Lin Y.L.; Tu C.-T.; C. ROBERT KAO | Journal of Electronic Materials |