Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2013 | Test Generation of Path Delay Faults Induced by Defects in Power TSV | CHIEN-MO LI ; Chi-Jih Shih; Shih-An Hsieh; Yi-Chang Lu; James Chien-Mo Li; Tzong-Lin Wu; K. Chakrabarty; CHIEN-MO LI | IEEE Asian Test Symposium | |||
2013 | Testing Leakage Faults of Power TSV in 3D IC | CHIEN-MO LI ; Chi-Jih Shih; Shih-An Hsieh; Yi-Chang Lu; James Chien-Mo Li; Tzong-Lin Wu; K. Chakrabarty; CHIEN-MO LI | IEEE Int’l workshop on 3D IC | |||
2014 | Testing of TSV-induced small delay faults for 3-D integrated circuits | Chun-Yi Kuo; Chi-Jih Shih; Yi-Chang Lu; James C.-M. Li; Krishnendu Chakrabarty; YI-CHANG LU ; CHIEN-MO LI | IEEE Trans. Very Large Scale Integration (VLSI) Systems | 17 | 13 | |
2012 | The effect of NBTI on 3D integrated circuits | Cheng-Hong Lin; Yi-Chang Lu; Chin-Khai Tang; Kuen-Yu Tsai; YI-CHANG LU ; KUEN-YU TSAI | Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE | |||
2011 | Thermal modeling and analysis for 3D-ICs with integrated microchannel cooling | Hitoshi Mizunuma; Yi-Chang Lu; Chia-Lin Yang; YI-CHANG LU | IEEE Trans. Computer-Aided Design of Integrated Circuits and Systems | |||
2009 | Thermal modeling and device noise properties of 3D-SOI technology | Tze Wee Chen; Jung Hoon Chun; Yi-Chang Lu; Reza Navid; Wei Wang; Chang-Lee Chen; Robert W. Dutton; YI-CHANG LU | IEEE Trans. Electron Devices | 1 | 0 | |
2018 | Three-dimensional dynamic programming accelerator for multiple sequence alignment | Ruei-Ting Chien; Yi-Lun Liao; Chien-An Wang; Yu-Cheng Li; Yi-Chang Lu; YI-CHANG LU | IEEE Nordic Circuits and Systems Conference | 2 | 0 |