公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2014 | Amorphous Pd layer as a highly effective oxidation barrier for surface finish of electronic terminals | Li C.C.; Shih W.L.; Chung C.K.; C. ROBERT KAO | Corrosion Science | |||
2019 | Effect of Ag concentration on small solder volume Ni/SnAg/Ni system | Yu J.J.; Yang S.; Chung C.K.; C. ROBERT KAO | 13th Electronic Circuits World Convention: Connecting the World | |||
2013 | Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D-IC applications | Yu J.J.; Chung C.K.; Yang S.; C. ROBERT KAO | International Symposium on Advanced Packaging Materials | |||
2013 | Grain refinement of solder materials by minor element addition | Chung C.K.; Yu J.J.; Yang T.L.; C. ROBERT KAO | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | 5 | 0 | |
2011 | The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction | Chen W.M.; Yang T.L.; Chung C.K.; C. ROBERT KAO | Scripta Materialia | 31 | 31 | |
2012 | Origin and evolution of voids in electroless Ni during soldering reaction | Chung C.K.; Chen Y.J.; Chen W.M.; C. ROBERT KAO | Acta Materialia | 32 | 32 | |
2010 | Oxidation behavior of ENIG and ENEPIG surface finish | Lee C.C.; Chuang H.Y.; Chung C.K.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | |||
2013 | Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering process | Chung C.K.; Chen Y.J.; Yang T.L.; C. ROBERT KAO | Journal of Electronic Materials | 9 | 7 | |
2019 | Refine microstructure of solder materials via minor element additions | Chung C.K.; Yu J.J.; Yang T.L.; C. ROBERT KAO | 13th Electronic Circuits World Convention: Connecting the World | |||
2013 | Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics | Chen Y.J.; Chung C.K.; Yang C.R.; C. ROBERT KAO | Microelectronics Reliability | |||
2014 | Volume shrinkage induced by interfacial reaction in micro-Ni/Sn/Ni joints | Li C.C.; Chung C.K.; Shih W.L.; C. ROBERT KAO | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | 28 | 26 |