公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2014 | A CMOS based polysilicon nanowire biosensor platform for different biological targets | CHIH-TING LIN ; Lin, H.-H.; Wang, I.-S.; Yen, P.-W.; Cheng, H.; Tsai, H.-H.; Liao, H.-H.; Lu, S.-J.; Chou, F.-C.; CHIH-TING LIN | Procedia Engineering | | | |
2013 | A CMOS wireless biomolecular sensing system-on-chip based on polysilicon nanowire technology | Huang, C.-W.; Huang, Y.-J.; Yen, P.-W.; Tsai, H.-H.; Liao, H.-H.; Juang, Y.-Z.; Lu, S.-S.; Lin, C.-T.; SHEY-SHI LU ; CHIH-TING LIN | Lab on a Chip - Miniaturisation for Chemistry and Biology | 38 | 34 | |
2013 | A fully integrated wireless CMOS microcantilever lab chip for detection of DNA from Hepatitis B virus (HBV) | Huang, C.-W.; Hsueh, H.-T.; Huang, Y.-J.; Liao, H.-H.; Tsai, H.-H.; Juang, Y.-Z.; Lin, T.-H.; Lu, S.-S.; Lin, C.-T.; SHEY-SHI LU ; TSUNG-HSIEN LIN ; CHIH-TING LIN | Sensors and Actuators, B: Chemical | 25 | 23 | |
2014 | A microfluidic-integrated biosensing SOC for cardiac troponin i detection in 0.35μM CMOS process | CHIH-TING LIN ; Yen, P.-W.; Lin, S.-C.; Huang, Y.-C.; Huang, Y.-J.; Tsai, H.-H.; Liao, H.-H.; Lu, S.-S.; CHIH-TING LIN | 18th International Conference on Miniaturized Systems for Chemistry and Life Sciences | | | |
2015 | Applications of Ag-Alloy stud bump for IC and LED packages | Tsai, H.-H.; Tsai, C.-H.; Lee, J.-D.; Chang, D.; Shih, Y.-T.; Chen, C.-H.; Chuang, T.-H.; TUNG-HAN CHUANG | 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings | | | |
2019 | Au-induced improvements in the grain stability and mechanical properties of Ag-based alloy wires under electrical current stressing | Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG | Journal of Materials Science: Materials in Electronics | | | |
2014 | Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current Stressing | Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Tsai, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2019 | Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires | Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG | Journal of Materials Science: Materials in Electronics | | | |
2013 | Effect of annealing twins on electromigration in Ag-8Au-3Pd bonding wires | Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2018 | Effect of Au Addition on the Microstructure and Properties of Ag-4Pd Bonding Wires | Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2012 | Effects of annealing twins on the grain growth and mechanical properties of Ag-8Au-3Pd bonding wires | Chuang, T.-H.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2013 | Formation and growth of intermetallics in an annealing-twinned Ag-8Au-3Pd wire bonding package during reliability tests | Chuang, T.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2010 | Heteroleptic ruthenium antenna-dye for high-voltage dye-sensitized solar cells | Li, J.-Y.; Chen, C.-Y.; Chen, J.-G.; Tan, C.-J.; Lee, K.-M.; Wu, S.-J.; Tung, Y.-L.; Tsai, H.-H.; Ho, K.-C.; Wu, C.-G.; KUO-CHUAN HO | Journal of Materials Chemistry | | | |
2013 | High performance Ag-Pd alloy wires for high frequency IC packages | Tsai, H.-H.; Chuang, T.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Lin, H.-J.; Chang, C.-C.; TUNG-HAN CHUANG | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | | | |
2012 | An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packaging | Tsai, H.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | | | |
2016 | Low temperature bonding of Pd/Ni assembly for hydrogen purifier | Lin, Y.-C.; Chuang, C.-H.; Tsai, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG | Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering | | | |
2016 | Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages | Tsai, C.-H.; Chuang, C.-H.; Tsai, H.-H.; Lee, J.-D.; Chang, D.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2018 | Preparation of iron mesoporous catalysis from hazardous waste for acetone treatment | Kao, C.-Y.; Nguyen, N.-T.; Lin, M.-F.; Tsai, H.-H.; Chang, C.-T.; Chang, L.-M.; Chen, P.-H.; PO-HAN CHEN | Proceedings of 4th IEEE International Conference on Applied System Innovation 2018, ICASI 2018 | | | |
2007 | Red phosphorescent material doped in the hole- And electron-transport layer of organic light-emitting device | Tseng, C.-A.; Tsai, H.-H.; Lee, J.-H.; Chen, C.-T.; Song, Y.-H.; Chi, Y.; JIUN-HAW LEE | Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS | | | |
2013 | Surface reconstruction of an annealing twinned Ag-8Au-3Pd alloy wire under current stressing | Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lin, H.-J.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |