第 1 到 24 筆結果,共 24 筆。
公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 | |
---|---|---|---|---|---|---|---|
1 | 1994 | 紫外線對高分子複合材料機械性質之影響 | 莊東漢 ; 曾峰柏; 顧鈞豪; Chuang, Tung-Han | 中國材料科學學會民國83年年會論文集 | |||
2 | 1996 | 台灣地區建材耐久性暨標準化研討會論文集 | 莊東漢 | 台灣地區建材耐久性暨標準化研討會, 1996 | |||
3 | 1992 | 以超音波量測陶瓷材料孔隙比之初步研究 | 吳政忠 ; 柴駿甫; 莊東漢 ; Chuang, Tung-Han | 中華民國第八屆非破壞檢測研討會論文集 | |||
4 | 2006 | Mechanical properties of intermetallic compounds on lead-free solder by moiré techniques | Tsai, I.; Wu, E.; Yen, S.F.; TUNG-HAN CHUANG | Journal of Electronic Materials | 19 | 17 | |
5 | 2015 | Magnetic pinning effect in YBa2Cu3O7-d/Nd0.35Sr0.65MnO3 bilayer | Cheng, S.; Lin, J. ; TUNG-HAN CHUANG | 2015 IEEE International Magnetics Conference, INTERMAG 2015 | 0 | 0 | |
6 | 2019 | Luminous efficiency of pd-doped ag-alloy wire bonded led package after reliability tests | Yuan, J.-H.; Chuang, T.-H.; TUNG-HAN CHUANG | Materials Science Forum | |||
7 | 2020 | Lumen maintenance of ternary Ag-alloy wire bonded LED package after reliability tests | Yuan, J.-H.; Chuang, T.-H.; Chuang, J.-H.; TUNG-HAN CHUANG | Materials Science Forum | |||
8 | 2016 | Low temperature bonding of Pd/Ni assembly for hydrogen purifier | Lin, Y.-C.; Chuang, C.-H.; Tsai, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG | Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering | |||
9 | 2006 | Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes | Chuang, T.H.; Yen, S.F.; Cheng, M.D.; TUNG-HAN CHUANG | Journal of Electronic Materials | |||
10 | 2006 | Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads | Liu, Y.U.-C.; Lin, W.-H.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | |||
11 | 2006 | Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu Pads | Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | |||
12 | 2006 | Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish | Chuang, T.-H.; Yen, S.-F.; Wu, H.-M.; TUNG-HAN CHUANG | Journal of Electronic Materials | |||
13 | 2012 | An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packaging | Tsai, H.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | |||
14 | 1994 | Inconel 718 之超塑性成形 | 莊東漢 ; 曹正文; Chuang, Tung-Han | 超塑性成形與擴張接合學術研討會論文集 | |||
15 | 2013 | High performance Ag-Pd alloy wires for high frequency IC packages | Tsai, H.-H.; Chuang, T.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Lin, H.-J.; Chang, C.-C.; TUNG-HAN CHUANG | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | |||
16 | 2008 | Fatigue life evaluation of ball grid array packages with Sn-Ag-Cu and rare-earth addition solder under cyclic bending test | Cheng, C.-Y.; Zhan, C.-J.; Chuang, T.-H.; TUNG-HAN CHUANG | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008 | |||
17 | 2012 | Dual-phase solid-liquid interdiffusion bonding, a solution for the die attachment of WBG | Chang, T.-C.; Chang, J.-Y.; Chuang, T.-H.; Lo, W.-C.; TUNG-HAN CHUANG | 14th International Conference on Electronic Materials and Packaging, EMAP 2012 | |||
18 | 2013 | Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrode | Yang, C.L.; Lai, H.J.; Hwang, J.D.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | 15 | 12 | |
19 | 2023 | Deposition of Ag Nanotwinned Films on Graphene/ Si Photoelectrochemical Cell for CO2 Reduction and Hydrogen Production | Chen, Yen Ting; Liu, Tsung Hsin; CHUN-WEI CHEN ; TUNG-HAN CHUANG | Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering | |||
20 | 2020 | Deposition of (111)-oriented Ag nano-twinned film on (111) Si wafer | Wu P.-C; Lee P.-I; Lai Y.-C; Lin Y.-C; Chuang T.-H.; TUNG-HAN CHUANG | Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering | |||
21 | 2017 | Corrosion and ion migration of Ag-alloy bonding wires with various Pd and Au contents | Chen C.-H; Lin Y.-C; Tsai C.-H; Wang S.-C; Tsai H.-H; Chuang T.-H.; TUNG-HAN CHUANG | EUROCORR 2017 - The Annual Congress of the European Federation of Corrosion, 20th International Corrosion Congress and Process Safety Congress 2017 | |||
22 | 2005 | Characterization of thin films and intermetallic compounds in solder joint | Tsai, I.; Tai, L.J.; Yen, S.F.; Chuang, T.H.; Lo, R.; Ku, T.; Wu, E.; TUNG-HAN CHUANG | Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 | |||
23 | 2021 | Atomic Migration of Cu in Ti/Ni/Cu/Ag Backside Metallization on Si Substrate | Lee, Pei Ing; Wu, Po Ching; TUNG-HAN CHUANG | Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering | 0 | 0 | |
24 | 2015 | Applications of Ag-Alloy stud bump for IC and LED packages | Tsai, H.-H.; Tsai, C.-H.; Lee, J.-D.; Chang, D.; Shih, Y.-T.; Chen, C.-H.; Chuang, T.-H.; TUNG-HAN CHUANG | 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings |