公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2000 | Degradation of corrosion resistance for Al 5083 alloy after thermal and superplastic forming processes | Chang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
2020 | Deposition of (111)-oriented Ag nano-twinned film on (111) Si wafer | Wu P.-C; Lee P.-I; Lai Y.-C; Lin Y.-C; Chuang T.-H.; TUNG-HAN CHUANG | Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering | | | |
2023 | Deposition of Ag Nanotwinned Films on Graphene/ Si Photoelectrochemical Cell for CO2 Reduction and Hydrogen Production | Chen, Yen Ting; Liu, Tsung Hsin; CHUN-WEI CHEN ; TUNG-HAN CHUANG | Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering | | | |
2018 | Design of diffusion barrier and buffer layers for ?]-Zn 4 Sb 3 mid-temperature thermoelectric modules | Chen L.-W.; Wang C.; Liao Y.-C.; Li C.-L.; Chuang T.-H. ; CHUN-HWAY HSUEH | Journal of Alloys and Compounds | | | |
2000 | Development of a low-melting-point filler metal for brazing aluminum alloys | Chuang, T. H.; Tsao, L. C.; Tsai, T. C.; Yeh, M. S.; Wu, C. S.; ChuangTH | Metallurgical and Materials Transactions A | 61 | | |
2000 | Diffusion bonding of a superplastic Inconel 718SPF superalloy by electroless nickel plating | Yeh, M.S.; Chang, C.B.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
1996 | Diffusion bonding/superplastic forming of Ti-6Al-6V-2Sn/SUS 304 Stainless Steel/Ti-6Al-6V-2Sn | Shyu, J.S.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
2013 | Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrode | Yang, C.L.; Lai, H.J.; Hwang, J.D.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | 15 | 12 | |
2013 | Diffusion soldering of Pb-doped gete thermoelectric modules with Cu electrodes using a thin-film Sn interlayer | Yang, C.L.; Lai, H.J.; Hwang, J.D.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
1989 | Discontinuous coarsening and dissolution in an Fe13.5at.%Zn solid solution | Chuang, T.-H.; Gust, W.; Predel, B.; Fournelle, R.A.; TUNG-HAN CHUANG | Materials Science and Engineering A | | | |
1988 | Discontinuous coarsening of discontinuous precipitate in a Ni-7.5 at.% In alloy | Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG | Acta Metallurgica | | | |
1998 | Discontinuous coarsening of discontinuous precipitates in a Co-6 at.% Mo alloy | Lee, S.-L.; Lee, K.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | Materials Science and Engineering A | | | |
1998 | Discontinuous coarsening of discontinuous precipitates in a Co–6 at.% Mo alloy | Lee, Shiu-Li; Lee, Kuan-Ching; Chuang, Tung-Han | Materials Science and Engineering A | | | |
2012 | Dual-phase solid-liquid interdiffusion bonding, a solution for the die attachment of WBG | Chang, T.-C.; Chang, J.-Y.; Chuang, T.-H.; Lo, W.-C.; TUNG-HAN CHUANG | 14th International Conference on Electronic Materials and Packaging, EMAP 2012 | | | |
2014 | Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current Stressing | Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Tsai, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2010 | The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads | Lin, Hsiu-Jen; Chuang, Tung-Han | Materials Letters | 9 | 8 | |
2009 | Effect of adding Ge on rapid whisker growth of Sn-3Ag-0.5Cu-0.5Ce alloy | Chuang, T.-H.; Chi, C.-C.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2011 | Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder | Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; TUNG-HAN CHUANG | Materials & Design (1980-2015) | 116 | 98 | |
2019 | Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires | Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG | Journal of Materials Science: Materials in Electronics | | | |
2013 | Effect of annealing twins on electromigration in Ag-8Au-3Pd bonding wires | Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |