公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1991 | Long-term oxidation behaviour of Ni3Al alloys with and without chromium additions | Pan, Y. C.; Chuang, T. H.; Yao, Y. D. | Journal of Materials Science | | | |
1995 | Low-pressure diffusion bonding of SAE 316 stainless steel by inserting a superplastic interlayer | Yeh, M. S.; Chuang, T. H. | Scripta Metallurgica et Materialia | | | |
1990 | Magnetization study on grain-boundary precipitation in a Ni-8 at. % Sn alloy | Yao, Y. D.; Chen, Y. Y.; Li, T. J.; Chuang, T. H. | J. Appl. Phys | | | |
2006 | Mechanical properties of intermetallic compounds on lead-free solder by moir? techniques | Tsai, Iting; Wu, Enboa; Yen, S. F.; Chuang, T. H. | Journal of Electronic Materials | | | |
2004 | Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates | Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; ChuangTH | Journal of Electronic Materials | | | |
2004 | Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions | Chuang, T. H.; Huang, K. W.; Lin, W. H.; ChuangTH | Journal of Electronic Materials | | | |
1998 | Microstructural Aspects of Serrated Yielding Behavior in the Al-Li 8090 Alloy | Chang, J. C.; Tsai, T. C.; Chuang, T. H. | Zeitschrift fur Metallkunde | | | |
2002 | Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate | Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. | Journal of Materials Engineering and Performance | | | |
2003 | Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy | Chang, S. Y.; Wang, S. S.; Tsao, L. C.; Chuang, T. H. | Metallurgical and Materials Transactions A | | | |
1991 | The Mutual Effects of B, Zr and Al on Grain Boundary Segregation in Ni3Al Intermetallic Compounds | Chuang, T. H. | Materials Science and Engineering A141: | | | |
1992 | On the mechanisms of high-temperature intergranular embrittlements of Ni3Al-Zr Alloys | Chuang, T. H.; Pan, Y. C.; ChuangTH | Metallurgical and Materials Transactions A23 | | | |
1996 | On the Relationship between Electrical Conductivity and Stress Corrosion Susceptibility of 7075 and 7475 Aluminum Alloys | Tsai, T.S.; Chuang, T. H. | Corrosion 52: | | | |
1996 | The oxidation behavior of Ni3Al---Zr alloys with various zirconium contents | Chang, T. T.; Pan, Y. C.; Chuang, T. H. | Journal of Alloys and Compounds | | | |
2002 | Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions | Chuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S.; ChuangTH | Journal of Electronic Materials | 44 | | |
2003 | Plasma-enhanced chemical-vapor deposition oxide prepared at low-flow conditions for course wavelength-division multiplexing optical-waveguide devices | Chu, A. K.; Lin, J. Y.; Wang, M. L.; Fan, C. C.; Shue, H. S.; Chuang, T. H.; Chen, S. Y.; Chiu, C. H.; Lin, S. F.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2000 | Plastic flow behavior during the forging of a 6061 Al/10 vol pct Al2O3 ( p ) composite | Yeh, M. S.; Weng, W. P.; Wang, S. C.; Chuang, T. H. | Metallurgical and Materials Transactions A | | | |
1999 | Progress on superplasticity and superplastic forming in Taiwan during 1987–1997 | Huang, J. C.; Chuang, T. H. | Materials Chemistry and Physics | | | |
1999 | Recent Research and Development Activities on superplasticity in Taiwan | Huang, J. C.; Chuang, T. H. | Materials Science Forum 304-306: | | | |
1999 | Recent research and development activities on superplasticity in Taiwan | Huang, J. C.; Chuang, T. H.; TUNG-HAN CHUANG | Towards Innovation in Superplasticity Ii | | | |
2004 | Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad | Chiang, M. J.; Chang, S. Y.; Chuang, T. H. | Journal of Electronic Materials | | | |