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Lai Y.S.
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Showing results 1 to 7 of 7
Issue Date
Title
Author(s)
Source
scopus
WOS
Fulltext/Archive link
2011
Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing
Ke J.H.; Yang T.L.; Lai Y.S.; C. ROBERT KAO
Acta Materialia
54
52
2011
Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging
Chuang H.Y.; Chen W.M.; Shih W.L.; Lai Y.S.; C. ROBERT KAO
Electronic Components and Technology Conference
2006
Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration
Lin Y.L.; Lai Y.S.; Tsai C.M.; C. ROBERT KAO
Journal of Electronic Materials
31
27
2008
Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration
Lin Y.L.; Lai Y.S.; Lin Y.W.; C. ROBERT KAO
Journal of Electronic Materials
2009
Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substrates
CHIEN-CHENG CHANG
; Lin Y.W.; Lai Y.S.; C. ROBERT KAO
Journal of Electronic Materials
6
5
2011
Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding
Lu Y.H.; Wang Y.W.; Appelt B.K.; Lai Y.S.; C. ROBERT KAO
Electronic Components and Technology Conference
2013
Serrated cathode dissolution under high current density: Morphology and root cause
Yang T.L.; Ke J.H.; Shih W.L.; Lai Y.S.; C. ROBERT KAO
Journal of Applied Physics
6
6