Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2003 | Electromigration failure in flip chip solder joints due to rapid dissolution of copper | Hu Y.C.; Lin Y.H.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Journal of Materials Research | |||
2005 | Electromigration-induced grain rotation in anisotropic conducting beta tin | Wu A.T.; Gusak A.M.; Tu K.N.; C. ROBERT KAO | Applied Physics Letters | |||
2004 | Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction | Wu A.T.; Tu K.N.; Lloyd J.R.; Tamura N.; Valek B.C.; C. ROBERT KAO | Applied Physics Letters | |||
2005 | In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing | Lin Y.H.; Hu Y.C.; Tsai C.M.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Acta Materialia | |||
2013 | Interfacial reactions and electromigration in flip-chip solder joints | Ho C.E.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Advanced Flip Chip Packaging | |||
2005 | Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton | Wu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Materials Research Society Symposium |