公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2017 | Characterization and crystallization kinetics of sputtered NiSi thin films for blue laser optical recording application | Ou, S.-L.; Chen, S.-C.; Lin, Y.-C.; Lin, P.-C.; Wen, C.-K.; Chuang, T.-H.; TUNG-HAN CHUANG | Vacuum | | | |
2000 | Characterization of alumina ceramics by ultrasonic testing | Chang, L.-S.; Chuang, T.-H.; TUNG-HAN CHUANG ; WEN-CHENG J. WEI | Materials Characterization | 45 | 41 | |
2021 | Characterization of interfacial structure for low-temperature direct bonding of Si substrates sputtered with Ag nanotwinned films | Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG | Materials Characterization | | | |
2002 | Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn-58Bi solders with Ni substrates | Chiu, M.Y.; Chang, S.Y.; Tseng, Y.H.; Chan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG | Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques | | | |
2005 | Characterization of thin films and intermetallic compounds in solder joint | Tsai, I.; Tai, L.J.; Yen, S.F.; Chuang, T.H.; Lo, R.; Ku, T.; Wu, E.; TUNG-HAN CHUANG | Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 | | | |
2019 | Comparison of microstructural and optoelectronic properties of NiO:Cu thin films deposited by ion-beam assisted rf sputtering in different gas atmospheres | Wen, C.-K.; Xin, Y.-Q.; Chen, S.-C.; Chuang, T.-H.; Chen, P.-J.; Sun, H.; TUNG-HAN CHUANG | Thin Solid Films | | | |
2017 | Corrosion and ion migration of Ag-alloy bonding wires with various Pd and Au contents | Chen C.-H; Lin Y.-C; Tsai C.-H; Wang S.-C; Tsai H.-H; Chuang T.-H.; TUNG-HAN CHUANG | EUROCORR 2017 - The Annual Congress of the European Federation of Corrosion, 20th International Corrosion Congress and Process Safety Congress 2017 | | | |
2001 | Corrosion behavior of Al-Si-Cu-(Sn, Zn) brazing filler metals | Wang, S.S.; Cheng, M.D.; Tsao, L.C.; Chuang, T.H.; TUNG-HAN CHUANG | Materials Characterization | | | |
2002 | Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements | Su, T.L.; Wang, S.S.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; Yeh, M.S.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
1996 | Corrosive wear of SiC whisker- and particulate-reinforced 6061 aluminum alloy composites | Yu, S.Y.; Ishii, H.; Chuang, T.H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2000 | Degradation of corrosion resistance for Al 5083 alloy after thermal and superplastic forming processes | Chang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
2020 | Deposition of (111)-oriented Ag nano-twinned film on (111) Si wafer | Wu P.-C; Lee P.-I; Lai Y.-C; Lin Y.-C; Chuang T.-H.; TUNG-HAN CHUANG | Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering | | | |
2023 | Deposition of Ag Nanotwinned Films on Graphene/ Si Photoelectrochemical Cell for CO2 Reduction and Hydrogen Production | Chen, Yen Ting; Liu, Tsung Hsin; CHUN-WEI CHEN ; TUNG-HAN CHUANG | Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering | | | |
2018 | Design of diffusion barrier and buffer layers for ?]-Zn 4 Sb 3 mid-temperature thermoelectric modules | Chen L.-W.; Wang C.; Liao Y.-C.; Li C.-L.; Chuang T.-H. ; CHUN-HWAY HSUEH | Journal of Alloys and Compounds | | | |
2000 | Development of a low-melting-point filler metal for brazing aluminum alloys | Chuang, T. H.; Tsao, L. C.; Tsai, T. C.; Yeh, M. S.; Wu, C. S.; ChuangTH | Metallurgical and Materials Transactions A | 61 | | |
2000 | Diffusion bonding of a superplastic Inconel 718SPF superalloy by electroless nickel plating | Yeh, M.S.; Chang, C.B.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
1996 | Diffusion bonding/superplastic forming of Ti-6Al-6V-2Sn/SUS 304 Stainless Steel/Ti-6Al-6V-2Sn | Shyu, J.S.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
2013 | Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrode | Yang, C.L.; Lai, H.J.; Hwang, J.D.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | 15 | 12 | |
2013 | Diffusion soldering of Pb-doped gete thermoelectric modules with Cu electrodes using a thin-film Sn interlayer | Yang, C.L.; Lai, H.J.; Hwang, J.D.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
1989 | Discontinuous coarsening and dissolution in an Fe13.5at.%Zn solid solution | Chuang, T.-H.; Gust, W.; Predel, B.; Fournelle, R.A.; TUNG-HAN CHUANG | Materials Science and Engineering A | | | |