公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2004 | Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints | Lin Y.L.; Luo W.C.; Lin Y.H.; Ho C.E.; C. ROBERT KAO | Journal of Electronic Materials | 17 | 16 | |
2003 | Electromigration failure in flip chip solder joints due to rapid dissolution of copper | Hu Y.C.; Lin Y.H.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Journal of Materials Research | |||
2005 | Electromigration induced metal dissolution in flip-chip solder joints | Lin Y.H.; Tsai C.M.; Hu Y.C.; Lin Y.L.; Tsai J.Y.; C. ROBERT KAO | Materials Science Forum | |||
2005 | Electromigration-induced failure in flip-chip solder joints | Lin Y.H.; Tsai C.M.; Hu Y.C.; Lin Y.L.; C. ROBERT KAO | Journal of Electronic Materials | 100 | 90 | |
2004 | Estimation of beat-to-beat systolic blood pressure using pulse arrive time and pulse width derived from the photoplethysmogram | Lin Y.H.; PATRICK CHOW-IN KO ; Wang H.Y.; TSUNG-CHIEN LU ; Chen Y.Y.; Jan I.C.; Jan G.J.; NAI-KUAN CHOU | Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings | |||
2020 | First report of Soybean Red Crown Rot Caused by Calonectria ilicicola in Taiwan | Liu H.H; Shen Y.M; HAO-XUN CHANG ; Tseng M.N; Lin Y.H. | Plant Disease | 5 | 5 | |
2005 | In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing | Lin Y.H.; Hu Y.C.; Tsai C.M.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Acta Materialia | |||
2020 | Long-term growth and bone development in children of HBV-infected mothers with and without fetal exposure to tenofovir disoproxil fumarate | Wen W.-H.; HUEY-LING CHEN ; TIFFANY TING-FANG SHIH ; JIA-FENG WU ; YEN-HSUAN NI ; CHIEN-NAN LEE ; Zhao L.-L.; Lai M.-W.; Mu S.-C.; YI-CHING TUNG ; HONG-YUAN HSU ; MEI-HWEI CHANG ; MING-KWANG SHYU ; HSIAO-LIN HWA ; Su Y.N.; JIN-CHUNG SHIH ; KUANG-HAN CHAO ; YU-CHUN CHIU ; KAI-CHI CHANG ; CHUN-JEN LIU ; TUNG-HUNG SU ; DING-SHINN CHEN ; Chen S.M.; Lin C.C.; Lin P.Y.; Yang W.R.; Hu J.J.; Yang C.K.; Chang Y.K.; Chen K.H.; Lin H.H.; Lin Y.H.; Chen H.J.; Pan H.S.; Lau B.H.; Lee C.L.; Cheng P.J.; Chang Y.L.; Chiueh H.Y.; Wang T.H.; Hsu J.J.; Lo L.M.; Hsieh C.L.; Cheng S.W.; Tsai M.S.; Lin L.H.; She B.Q.; Peng F.S.; Lin Y.C.; Chen C.P.; Huang J.P.; Yeung C.Y.; Taiwan Study Group for the Prevention of Mother-to-Infant Transmission of HBV (PreMIT study) | Journal of Hepatology | 24 | 21 | |
2002 | New failure mode induced by electric current in flip chip solder joint | Lin Y.H.; Hu Y.C.; Tsai J.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging 2002 | |||
2001 | A pump control index for reducing suction and backflow effect caused by the portable centrifugal blood pump | Lin Y.H.; NAI-KUAN CHOU ; Chen Y.Y.; Jan G.J. | Annual Reports of the Research Reactor Institute, Kyoto University | |||
2006 | The relation between serum level of amioterminal propeptide of type I procollagen and diastolic dysfunction in hypertensive patients without diabetes mellitus: A pilot study | Lin Y.H.; Chiu Y.W.; Shiau Y.C.; RUOH-FANG YEN ; I-JUNG TSAI ; YI-LWUN HO ; Huang P.J. | Journal of Human Hypertension | 7 | 5 | |
2014 | Systematic review of treatment modalities for gingival depigmentation: A random-effects poisson regression analysis | Lin Y.H.; YU-KANG TU ; Lu C.T.; Chung W.C.; Huang C.F.; Huang M.S.; Lu H.K. | Journal of Esthetic and Restorative Dentistry | 22 | 13 | |
2018 | Timing of cochlear implantation in auditory neuropathy patients with OTOF mutations: Our experience with 10 patients | Chen-Chi Wu ; Hsu C.J.; Huang F.L.; Lin Y.H.; Lin Y.H.; TIEN-CHEN LIU ; Wu C.M. | Clinical Otolaryngology | 19 | 17 | |
2008 | UV-curable low-surface-energy fluorinated poly(urethane-acrylate)s for biomedical applications | Lin Y.H.; Liao K.H.; NAI-KUAN CHOU ; SHOEI-SHEN WANG ; Chu S.H.; Hsieh K.H. | European Polymer Journal | 54 | 47 |