Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2009 | Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates | Wang Y.W.; Lin Y.W.; C. ROBERT KAO | Microelectronics Reliability | |||
2008 | Pronounced electromigration of Cu in molten Sn-based solders | Huang J.R.; Tsai C.M.; Lin Y.W.; C. ROBERT KAO | Journal of Materials Research | |||
2007 | Tin whisker growth induced by high electron current density | Lin Y.W.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | |||
2008 | Tin whisker growth induced by high electron current density | Lin Y.W.; Lai Y.-S.; Lin Y.L.; Tu C.-T.; C. ROBERT KAO | Journal of Electronic Materials | |||
2005 | Volume effect on the soldering reaction between SnAgCu solders and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; C. ROBERT KAO | International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces |