公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2003 | Chemical reaction in solder joints of microelectronic packages | Ho C.E.; Lin Y.L.; Tsai J.Y.; C. ROBERT KAO | Journal of the Chinese Institute of Chemical Engineers | |||
2005 | Controlling the microstructures from the gold-tin reaction | Tsai J.Y.; Chang C.W.; Shieh Y.C.; Hu Y.C.; C. ROBERT KAO | Journal of Electronic Materials | |||
2002 | The effect of Ni on the interfacial reaction between Sn-Ag solder and Cu metallization | Tsai J.Y.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging | |||
2005 | Electromigration induced metal dissolution in flip-chip solder joints | Lin Y.H.; Tsai C.M.; Hu Y.C.; Lin Y.L.; Tsai J.Y.; C. ROBERT KAO | Materials Science Forum | |||
2006 | Local melting induced by electromigration in flip-chip solder joints | Tsai C.M.; Lin Y.L.; Tsai J.Y.; Lai Y.I.-S.; C. ROBERT KAO | Journal of Electronic Materials | 61 | 58 | |
2006 | Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates | Tsai J.Y.; Chang C.W.; Ho C.E.; Lin Y.L.; C. ROBERT KAO | Journal of Electronic Materials | 40 | 34 | |
2007 | Optical properties of InGaN quantum dots grown by Si Nx nanomasks | Huang L.L.; Chang H.J.; Chou Y.Y.; Wang C.H.; Chen T.T.; Chen Yang Fang ; Tsai J.Y.; Wang S.C.; Kuo H.C. | Journal of Applied Physics | 12 | 12 | |
2005 | Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations | Luo W.C.; Ho C.E.; Tsai J.Y.; Lin Y.L.; C. ROBERT KAO | Materials Science and Engineering A | |||
2003 | A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni | Tsai J.Y.; Hu Y.C.; Tsai C.M.; C. ROBERT KAO | Journal of Electronic Materials |