公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2016 | Choice of Intermetallic Compounds for Structural Applications in Near Submicron Joints | Yu J.J.; Wu J.Y.; Yu L.J.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2019 | Creep Behaviors Along Characteristic Crystal Orientations of Sn and Sn-1.8Ag by Using Nanoindentation | Chiang P.J.; Wu J.Y.; Yu H.Y.; C. ROBERT KAO | JOM | |||
2018 | Creep mechanism in characteristic orientation of Sn and Sn-1.8Ag by nanoindentation | Chiang P.J.; Wu J.Y.; Liao Y.C.; C. ROBERT KAO | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | |||
2015 | Effect of Ag concentration on Ni/Sn-xAg/Ni micro joints under space confinement | Yu J.J.; Wu J.Y.; Yang S.; C. ROBERT KAO | 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference | |||
2017 | Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro joints | Yang H.W.; Wu J.Y.; Zhu Z.X.; C. ROBERT KAO | Materials Chemistry and Physics | |||
2016 | Full intermetallic joints for chip stacking by using thermal gradient bonding | Yang T.L.; Aoki T.; Matsumoto K.; Toriyama K.; Horibe A.; Mori H.; Orii Y.; Wu J.Y.; C. ROBERT KAO | Acta Materialia | |||
2015 | In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro joints | Yu J.J.; Wu J.Y.; Yu L.J.; C. ROBERT KAO | 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference | |||
2015 | Low temperature bonding for high temperature applications by using SnBi solders | Yang T.L.; Wu J.Y.; Li C.C.; Yang S.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
2004 | Magnetocardiography of animals in magnetically shielded environment with active compensation | Horng H.E.; Liao S.H.; SHIH-JER HSU ; Yang H.C.; Wu J.Y.; Chen C.C.; Wu C.H.; CHAU-CHUNG WU | Neurology and Clinical Neurophysiology | |||
2019 | Mechanical characterizations of single-crystalline (Cu, Ni) 6 Sn 5 through uniaxial micro-compression | Wu J.Y.; Chiu Y.S.; Wang Y.W.; C. ROBERT KAO | Materials Science and Engineering A | |||
2017 | Micromechanical behavior of single crystalline Ni 3 Sn 4 in micro joints for chip-stacking applications | Yu L.J.; Yen H.W.; Wu J.Y.; Yu J.J.; C. ROBERT KAO ; HUNG-WEI YEN | Materials Science and Engineering A | 10 | 10 | |
2017 | Micromechanical behavior of single-crystalline Cu 6 Sn 5 by picoindentation | Yu J.J.; Wu J.Y.; Yu L.J.; Yang H.W.; C. ROBERT KAO | Journal of Materials Science | |||
2007 | More evidence supports the association of PPP3CC with schizophrenia | Liu Y.L.; Fann C.S.J.; Liu C.M.; Chang C.C.; Yang W.C.; Hung S.I.; SUNG-LIANG YU ; TZUNG-JENG HWANG ; MING-HSIEN HSIEH ; Liu C.C.; Tsuang M.M.; Wu J.Y.; Jou Y.S.; Faraone S.V.; Tsuang M.T.; WEI J. CHEN ; Hwu H.-G. | Molecular Psychiatry | 48 | 48 | |
1996 | On the optimized nucleation of near-single-crystal CVD diamond film | Chen L.C.; Juan C.C.; Wu J.Y.; Chen K.H.; Teng J.W.; LI-CHYONG CHEN | Materials Research Society Symposium - Proceedings | 2 | ||
2018 | Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications | Wang Y.W.; Yang T.L.; Wu J.Y.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
2005 | R1193Q of SCN5A, a Brugada and long QT mutation, is a common polymorphism in Han Chinese. | Hwang H.W.; JIEN-JIUN CHEN ; Lin Y.J.; Shieh R.C.; Lee M.T.; Hung S.I.; Wu J.Y.; Chen Y.T.; Niu D.M.; Hwang B.T. | Journal of medical genetics | 49 | 42 |