公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2006 | Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu | Yang S.C.; Ho C.E.; Chang C.W.; C. ROBERT KAO | Journal of Materials Research | | | |
2016 | Study of Sintered Nano-Silver Die Attachment Materials Doped with Indium | Yang C.A.; C. ROBERT KAO | Electronic Components and Technology Conference | | | |
2010 | Study of UBM consumption in flip chip solder joints under varied extra-high current density with local temperature control | Yang T.L.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | 0 | 0 | |
2003 | A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni | Tsai J.Y.; Hu Y.C.; Tsai C.M.; C. ROBERT KAO | Journal of Electronic Materials | | | |
2020 | Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-Pillars | Yu H.Y.; Yang T.H.; Chiu Y.S.; C. ROBERT KAO | Journal of Electronic Materials | | | |
2005 | Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton | Wu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Materials Research Society Symposium | | | |
2022 | Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure | Lee P.-T; Hsieh W.-Z; Lee C.-Y; Tseng S.-C; Tang M.-T; Chiang C.-Y; C. ROBERT KAO ; Ho C.-E. | Scripta Materialia | 2 | 2 | |
1995 | Synthesis of in situ composites through solid-state reactions: thermodynamic, mass-balance and kinetic considerations | Kao C.R.; Woodford J.; Kim S.; Zhang M.-X.; Chang Y.A.; C. ROBERT KAO | Materials Science and Engineering A | | | |
2012 | Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium | Chen W.M.; Kang S.K.; C. ROBERT KAO | Electronic Components and Technology Conference | | | |
2010 | Temperature effects on electromigration behavior of solder joints | Ke J.-H.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | | | |
2022 | Terminal Reaction Behaviors in Micro Bumps: Comparison of Ti and Cr Adhesion Layers | Kao, Chen Wei; Kung, Po Yu; Chang, Chih Chia; C. ROBERT KAO | 2022 International Conference on Electronics Packaging, ICEP 2022 | 0 | 0 | |
1993 | A theoretical analysis for the formation of periodic layered structure in ternary diffusion couples involving a displacement type of reactions | Kao C.R.; Chang Y.A.; C. ROBERT KAO | Acta Metallurgica Et Materialia | | | |
2022 | Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface | Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |
2014 | Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow | Key Chung C.; Zhu Z.X.; C. ROBERT KAO | Journal of Electronic Materials | | | |
2008 | Tin whisker growth induced by high electron current density | Lin Y.W.; Lai Y.-S.; Lin Y.L.; Tu C.-T.; C. ROBERT KAO | Journal of Electronic Materials | | | |
2007 | Tin whisker growth induced by high electron current density | Lin Y.W.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | | | |
2010 | Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints | Tsai, M.Y.; Lin, Y.L.; Lin, Y.W.; Ke, J.H.; C. ROBERT KAO | Journal of electronic materials | 2 | 2 | |
2009 | Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder joints | Tsai M.-Y.; Lin Y.-L.; C. ROBERT KAO | IMPACT Conference 2009 International 3D IC Conference | | | |
2010 | Uncovering the driving force for massive spalling in the Sn-Cu/Ni system | Chen, W.M.; Yang, S.C.; Tsai, M.H.; C. ROBERT KAO | Scripta Materialia | 27 | 25 | |
2000 | Using tert-butyl alcohol as an adductive agent for separation of an m-cresol and 2,6-xylenol mixture | Lee, L. S.; Lin, C. W.; Kao, C. H.; C. ROBERT KAO | Industrial & Engineering Chemistry Research | | 17 | |