第 1 到 23 筆結果,共 23 筆。
公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 | |
---|---|---|---|---|---|---|---|
1 | 2012 | Elimination of voids in reactions between Ni and Sn: A novel effect of silver | Chuang, H.Y.; Yu, J.J.; Kuo, M.S.; Tong, H.M.; C. ROBERT KAO | Scripta Materialia | 79 | 76 | |
2 | 2012 | The critical oxide thickness for Pb-free reflow soldering on Cu substrate | Chung, C.Key; Chen, Y.J.; Li, C.C.; C. ROBERT KAO | Thin Solid Films | 26 | 23 | |
3 | 2012 | Effects of Ti addition to Sn–Ag and Sn–Cu solders | Chen, W.M.; Kang, S.K.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
4 | 2012 | Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing | Ke, J.H.; Chuang, H.Y.; Shih, W.L.; C. ROBERT KAO | Acta Materialia | 67 | 67 | |
5 | 2011 | Experimental Evidence for Formation of Ni-Al Compound in Flip-Chip Joints Under Current Stressing | Tsai, M.Y.; Lin, Y.L.; Tsai, M.H.; Chen, Y.J.; C. ROBERT KAO | Journal of ELECTRONIC MATERIALS | 1 | 1 | |
6 | 2011 | Laminar pattern induced by cycling thermomechanical stress in two-phase materials | Chang, C.C.; Chen, Y.J.; Tsai, M.Y.; C. ROBERT KAO ; CHIEN-CHENG CHANG | Materials Chemistry and Physics | 0 | 0 | |
7 | 2011 | Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints | Liu, Chao Sheng; Ho, Cheng En; Peng, Cheng Sam; C. ROBERT KAO | Journal of electronic materials | 32 | 28 | |
8 | 2011 | Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding | Chen, Jiunn ; Lai, Yi-Shao; Wang, Yi-Wun; C. ROBERT KAO | Microelectronics Reliability | 50 | 42 | |
9 | 2010 | Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer | CHIEN-CHENG CHANG ; Chung, H.Y.; Lai, Y.S.; C. ROBERT KAO | Journal of electronic materials | 9 | 7 | |
10 | 2010 | Direct evidence for a Cu-enriched region at the boundary between Cu6Sn5 and Cu3Sn during Cu/Sn reaction | Chung, C.Key; Duh, Jenq-Gong; C. ROBERT KAO | Scripta Materialia | 46 | 44 | |
11 | 2010 | Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints | Tsai, M.Y.; Lin, Y.L.; Lin, Y.W.; Ke, J.H.; C. ROBERT KAO | Journal of electronic materials | 2 | 2 | |
12 | 2010 | Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints | CHIEN-CHENG CHANG ; Wang, Y.W.; Lai, Y.S.; C. ROBERT KAO | Journal of electronic materials | 8 | 7 | |
13 | 2010 | Electromigration in flip chip solder joints under extra high current density | Lin, Y.W.; Ke, J.H.; Chuang, H.Y.; Lai, Y.S.; C. ROBERT KAO | Journal of Applied Physics | 23 | 23 | |
14 | 2010 | Effects of Ni Additions on the Growth of Cu3Sn in High-Lead Solders | Wang, Y.W.; CHIEN-CHENG CHANG ; Chen, W.M.; C. ROBERT KAO | Journal of Electronic Materials | 7 | 7 | |
15 | 2010 | Uncovering the driving force for massive spalling in the Sn-Cu/Ni system | Chen, W.M.; Yang, S.C.; Tsai, M.H.; C. ROBERT KAO | Scripta Materialia | 27 | 25 | |
16 | 2010 | Novel Cu-RuNx composite layer with good solderability and very low consumption rate | Chuang, H.Y.; Lin, C.H.; Chu, J.P.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
17 | 2010 | Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn-Zn systems | Tsai, M.Y.; Yang, S.C.; Wang, Y.W.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
18 | 2010 | Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders | Wang, Y.W.; Lin, Y.W.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
19 | 2010 | The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering | Lin, Y.W.; Wang, Y.W.; C. ROBERT KAO ; CHIEN-CHENG CHANG | Journal of Alloys and Compounds | |||
20 | 2010 | Sn concentration effect on the formation of intermetallic compounds in high-Pb/Ni reactions | Tsai, M.H.; Chen, W.M.; Tsai, M.Y.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
21 | 2010 | Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni | Yang, S.C.; Chang, C.C. ; Tsai, M.H.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
22 | 2008 | Lead-Free and Lead-Bearing Electronic Solders: Implementation, Reliability, and New Technology | Kao, C. Robert | JOM | |||
23 | 2007 | Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness | Chang, Chien Wei; Yang, Su Chun; Tu, Chun-Te; Kao, C. Robert | Journal of Electronic Materials |