公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2020 | Phase stabilities and interfacial reactions of the Cu�VIn binary systems | Lin, Y.F.; Hung, H.T.; Yu, H.Y.; Kao, C.R.; Wang, Y.W.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | | 8 | |
2013 | Precipitation induced by diffusivity anisotropy in Sn grains under electron current stressing | Huang, T.C.; Yang, T.L.; Ke, J.H.; Li, C.C.; C. ROBERT KAO | Journal of Alloys and Compounds | | | |
2020 | Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver�Vindium multilayer structure | Sheikhi, R.; Huo, Y.; Tsai, C.-H.; Kao, C.R.; Shi, F.G.; Lee, C.C.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | | | |
2018 | Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications | Wang Y.W.; Yang T.L.; Wu J.Y.; C. ROBERT KAO | Journal of Alloys and Compounds | | | |
2008 | Pronounced electromigration of Cu in molten Sn-based solders | Huang J.R.; Tsai C.M.; Lin Y.W.; C. ROBERT KAO | Journal of Materials Research | | | |
1999 | Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering | Ho C.E.; Chen Y.M.; C. ROBERT KAO | Journal of Electronic Materials | | | |
2001 | Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering | Ho C.E.; Tsai S.Y.; C. ROBERT KAO | IEEE Transactions on Advanced Packaging | | | |
2019 | Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications | Wang Y.W.; Shih W.L.; Hung H.T.; C. ROBERT KAO | Journal of Electronic Materials | | | |
2002 | Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages | Shiau L.C.; Ho C.E.; C. ROBERT KAO | Soldering and Surface Mount Technology | 110 | 101 | |
2013 | Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering process | Chung C.K.; Chen Y.J.; Yang T.L.; C. ROBERT KAO | Journal of Electronic Materials | 9 | 7 | |
1997 | Reactions of solid copper with pure liquid tin and liquid tin saturated with copper | Hayashi A.; Kao C.R.; Chang Y.A.; C. ROBERT KAO | Scripta Materialia | | | |
1996 | Reactive diffusion between silicon and niobium carbide: Application to the in-situ synthesis of a silicon carbide-niobium disilicide composite | Kao C.R.; Woodford J.; Chang Y.A.; C. ROBERT KAO | TMS Annual Meeting | | | |
2020 | The real demonstration of High-Quality Carbon Nano-Tubes (CNTs) as the electrical connection for the potential application in a vertical 3D integrated technology | Lu, P.-Y.; Li, Y.-R.; Yen, C.-M.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; MING-HAN LIAO ; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 4 | 0 | |
2003 | Recent progress in phase diagram calculation and application | C. ROBERT KAO | JOM | 1 | 1 | |
2015 | Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping | Bashir M.N.; Haseeb A.S.M.A.; Rahman A.Z.M.S.; Fazal M.A.; C. ROBERT KAO | Journal of Materials Science | | | |
2019 | Refine microstructure of solder materials via minor element additions | Chung C.K.; Yu J.J.; Yang T.L.; C. ROBERT KAO | 13th Electronic Circuits World Convention: Connecting the World | | | |
2001 | Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish | Liu C.M.; Ho C.E.; Chen W.T.; C. ROBERT KAO | Journal of Electronic Materials | | | |
2013 | Reliability of micro-interconnects in 3D IC packages | Robert Kao, C.; Wu, Albert T.; Tu, King-Ning; Lai, Yi-Shao; C. ROBERT KAO | Microelectronics Reliability | | | |
2007 | Role of minor Zn addition in the interfacial reaction between lead-free solders and Cu | Yang S.C.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | | | |
2012 | Roles of phosphorous in Sn 4Ag 0.5Cu solder reaction with electrolytic Ni-Au | Key Chung C.; Huang T.C.; Shia R.; Yang T.L.; C. ROBERT KAO | Journal of Alloys and Compounds | 7 | 9 | |