公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2003 | Chemical reaction in solder joints of microelectronic packages | Ho C.E.; Lin Y.L.; Tsai J.Y.; C. ROBERT KAO | Journal of the Chinese Institute of Chemical Engineers | |||
2006 | Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples | Chang C.W.; Lee Q.P.; Ho C.E.; C. ROBERT KAO | Journal of Electronic Materials | 24 | 23 | |
2002 | Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders | Chen W.T.; Ho C.E.; C. ROBERT KAO | Journal of Materials Research | 216 | 193 | |
2002 | Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni | Ho C.E.; Tsai R.Y.; Lin Y.L.; C. ROBERT KAO | Journal of Electronic Materials | |||
2006 | Effects of limited Cu supply on soldering reactions between SnAgCu and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 138 | 116 | |
2004 | Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints | Lin Y.L.; Luo W.C.; Lin Y.H.; Ho C.E.; C. ROBERT KAO | Journal of Electronic Materials | 17 | 16 | |
2000 | Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish | Ho C.E.; Zheng R.; Luo G.L.; Lin A.H.; C. ROBERT KAO | Journal of Electronic Materials | |||
2002 | Inhibiting the formation of (Au1-xNix)Sn4 and reducing the consumption of Ni metallization in solder joints | Ho C.E.; Shiau L.C.; C. ROBERT KAO | Journal of Electronic Materials | |||
2001 | Interactions between solder and metallization during long-term aging of advanced microelectronic packages | Ho C.E.; Chen W.T.; C. ROBERT KAO | Journal of Electronic Materials | |||
2007 | Interfacial reaction issues for lead-free electronic solders | Ho C.E.; Yang S.C.; C. ROBERT KAO | Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics | |||
2007 | Interfacial reaction issues for lead-free electronic solders | Ho C.E.; Yang S.C.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | |||
2013 | Interfacial reactions and electromigration in flip-chip solder joints | Ho C.E.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Advanced Flip Chip Packaging | |||
2006 | Kinetics of AuSn 4 migration in lead-free solders | Chang C.W.; Ho C.E.; Yang S.C.; C. ROBERT KAO | Journal of Electronic Materials | 23 | 20 | |
2000 | Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate | Chen C.; Ho C.E.; Lin A.H.; Luo G.L.; C. ROBERT KAO | Journal of Electronic Materials | |||
2007 | Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element | Yang S.C.; Ho C.E.; Chang C.W.; C. ROBERT KAO | Journal of Applied Physics | |||
2006 | Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates | Tsai J.Y.; Chang C.W.; Ho C.E.; Lin Y.L.; C. ROBERT KAO | Journal of Electronic Materials | 40 | 34 | |
2000 | Optimizing the wire-bonding parameters for second bonds in ball grid array packages | Ho C.E.; Chen C.; C. ROBERT KAO | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers, Series A/Chung-kuo Kung Ch'eng Hsuch K'an | |||
1999 | Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system | Jain T.A.; Huang C.G.; Ho C.E.; C. ROBERT KAO | Materials Transactions | |||
1999 | Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering | Ho C.E.; Chen Y.M.; C. ROBERT KAO | Journal of Electronic Materials | |||
2001 | Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering | Ho C.E.; Tsai S.Y.; C. ROBERT KAO | IEEE Transactions on Advanced Packaging |