第 1 到 254 筆結果,共 254 筆。
公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 | |
---|---|---|---|---|---|---|---|
1 | 2022 | Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation | Tatsumi, Hiroaki; C. ROBERT KAO ; Nishikawa, Hiroshi | Scientific Reports | 3 | 1 | |
2 | 2022 | Periodic copper microbead array on silver layer for dual mode detection of glyphosate | Balaji, Ramachandran; Renganathan, Vengudusamy; Chu, Chia Pei; YING-CHIH LIAO ; C. ROBERT KAO ; Chen, Shen Ming | OpenNano | 2 | 0 | |
3 | 2022 | Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration | Kung, Po Yu; Huang, Wei Lun; Kao, Chin Li; YUNG-SHENG LIN; Hung, Yun Ching; C. ROBERT KAO | Materials | 1 | 0 | |
4 | 2022 | Flow in a microchannel filled with arrays of numerous pillars | Gräfner, S. J.; Wu, P. Y.; C. ROBERT KAO | International Journal of Heat and Fluid Flow | 2 | 0 | |
5 | 2022 | Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps | Kao, Chen Wei; Kung, Po Yu; Chang, Chih Chia; Huang, Wei Chen; Chang, Fu Ling; C. ROBERT KAO | Materials | 2 | 2 | |
6 | 2022 | Terminal Reaction Behaviors in Micro Bumps: Comparison of Ti and Cr Adhesion Layers | Kao, Chen Wei; Kung, Po Yu; Chang, Chih Chia; C. ROBERT KAO | 2022 International Conference on Electronics Packaging, ICEP 2022 | 0 | 0 | |
7 | 2022 | Formation Mechanism of high Ni content (Cu, Ni)6Sn5in Cu/Sn/Ni microbump for solid state aging | Yu, Haiyang; C. ROBERT KAO | Proceedings of 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2022 | 0 | 0 | |
8 | 2022 | Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating | Chen, Y. A.; Shih, P. S.; Chang, F. L.; Grafner, S. J.; Huang, J. H.; Huang, C. H.; C. ROBERT KAO ; Lin, Y. S.; Hung, Y. C.; Kao, C. L.; Tarng, D. | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |
9 | 2022 | High-Temperature Reliability of Sintered Silver-Tin Alloy Paste for Die Attach Applications | Huang, Wei Chen; Tsai, Chin Hao; C. ROBERT KAO | 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings | 0 | 0 | |
10 | 2022 | A novel method of low temperature, pressureless interconnection for wafer level scale 3D packaging | Shih, P. S.; Shen, C. H.; Chen, Y. A.; Huang, C. H.; Grafner, S. J.; Huang, J. H.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |
11 | 2022 | Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface | Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |
12 | 2022 | Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Microfluidic Electroless Interconnection | YUNG-SHENG LIN; Hung, Yun Ching; Kao, Chin Li; Lai, Chung Hung; Shih, Po Shao; Huang, Jeng Hau; Tarng, David; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |
13 | 2022 | Key steps from laboratory towards mass production: Optimization of electroless plating process through numerical simulation | Grafner, S. J.; Huang, J. H.; Chen, Y. A.; Shih, P. S.; Huang, C. H.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 3 | 0 | |
14 | 2022 | Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices | Tsai C.-H; Huang W.-C; C. ROBERT KAO | Materials | 4 | 4 | |
15 | 2022 | Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure | Lee P.-T; Hsieh W.-Z; Lee C.-Y; Tseng S.-C; Tang M.-T; Chiang C.-Y; C. ROBERT KAO ; Ho C.-E. | Scripta Materialia | 2 | 2 | |
16 | 2022 | Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution | Huang J.H; Shih P.S; Renganathan V; Grӓfner S.J; Chen Y.A; Huang C.H; Kao C.L; Lin Y.S; Hung Y.C; C. ROBERT KAO | Electrochimica Acta | 8 | 6 | |
17 | 2022 | Hydrothermally constructed AgWO4-rGO nanocomposites as an electrode enhancer for ultrasensitive electrochemical detection of hazardous herbicide crisquat | Maheshwaran S; Renganathan V; Chen S.-M; Balaji R; C. ROBERT KAO ; Chandrasekar N; Ethiraj S; Samuel M.S; Govarthanan M. | Chemosphere | 19 | 12 | |
18 | 2022 | Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis | Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; C. ROBERT KAO | Electroanalysis | |||
19 | 2021 | Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment | Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; C. ROBERT KAO | Journal of Materials Research and Technology | |||
20 | 2021 | Numerical analysis of an electroless plating problem in gas–liquid two-phase flow | Wu P.-Y; Pironneau O; Shih P.-S; C. ROBERT KAO | Fluids | |||
21 | 2021 | Highly uniform microfluidic electroless interconnections for chip stacking applications | Hung H.T; Ma Z.D; Shih P.S; Huang J.H; Kao L.Y; Yang C.Y; Renganathan V; Kao C.L; Hung Y.C; C. ROBERT KAO | Electrochimica Acta | |||
22 | 2021 | White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5 | Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO | 2021 International Conference on Electronics Packaging, ICEP 2021 | |||
23 | 2021 | Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications | Zhu Z.X; Renganathan V; C. ROBERT KAO | Journal of Electronic Materials | |||
24 | 2021 | Copper sulfide nano-globules reinforced electrodes for high-performance electrochemical determination of toxic pollutant hydroquinone | Maheshwaran S; Balaji R; Chen S.-M; Biswadeep R; Renganathan V; Narendhar C; C. ROBERT KAO | New Journal of Chemistry | |||
25 | 2021 | A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn | Tsai C.-H; Lin S.-Y; Lee P.-T; C. ROBERT KAO | Intermetallics | |||
26 | 2020 | The demonstration of carbon nanotubes (CNTs) as flip-chip connections in 3-D integrated circuits with an ultralow connection resistance | Liao, M.-H.; Lu, P.-Y.; Su, W.-J.; Chen, S.-C.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; MING-HAN LIAO ; WEI-JIUN SU ; C. ROBERT KAO | IEEE Transactions on Electron Devices | 6 | ||
27 | 2020 | Artifact-free microstructures of the Cu-In reaction by using cryogenic broad argon beam ion polishing | Hung H.T; Lee P.T; Tsai C.H; C. ROBERT KAO | Journal of Materials Research and Technology | |||
28 | 2020 | Interconnections of low-temperature solder and metallizations | Wang Y; C. ROBERT KAO | Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020 | |||
29 | 2020 | Phase stabilities and interfacial reactions of the Cu�VIn binary systems | Lin, Y.F.; Hung, H.T.; Yu, H.Y.; Kao, C.R.; Wang, Y.W.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | 8 | ||
30 | 2020 | The real demonstration of High-Quality Carbon Nano-Tubes (CNTs) as the electrical connection for the potential application in a vertical 3D integrated technology | Lu, P.-Y.; Li, Y.-R.; Yen, C.-M.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; MING-HAN LIAO ; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 4 | 0 | |
31 | 2020 | Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver�Vindium multilayer structure | Sheikhi, R.; Huo, Y.; Tsai, C.-H.; Kao, C.R.; Shi, F.G.; Lee, C.C.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | |||
32 | 2020 | Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressure | Chiu, Y.S.; Kao, C.R.; Shigetou, A.; C. ROBERT KAO | Materials and Design | 0 | ||
33 | 2020 | Effects of Isothermal Heat Treatment on Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection Structure | Hung H.T; Yang S; Shih P.S; Ma Z.D; Huang J.H; C. ROBERT KAO | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | |||
34 | 2020 | Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-Pillars | Yu H.Y.; Yang T.H.; Chiu Y.S.; C. ROBERT KAO | Journal of Electronic Materials | |||
35 | 2020 | Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface Finish | Weng, I.A.; Hung, H.T.; Huang, W.C.; Kao, C.R.; Chen, Y.H.; C. ROBERT KAO | Journal of Electronic Materials | 5 | ||
36 | 2020 | Sintered Micro-Silver Paste Doped with Indium for Die Attachment Applications of Power ICs | Tsai, C.-H.; Huang, W.-C.; Kao, C.R.; Chew, L.M.; Schmitt, W.; Nishikawa, H.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | |||
37 | 2020 | Foldable Kirigami Paper Electronics | Yang T.H; Hida H; Ichige D; Mizuno J; Robert Kao C; Shintake J.; C. ROBERT KAO | Physica Status Solidi (A) Applications and Materials Science | |||
38 | 2019 | Micropillar mechanics of Sn-based intermetallic compounds | Yu, J.J.; Wu, J.Y.; Yu, L.J.; C. ROBERT KAO | Handbook of Mechanics of Materials | |||
39 | 2019 | Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits | Weng I.A.; Hung H.T.; Yang S.; Kao C.R.; Chen Y.H.; C. ROBERT KAO | Scripta Materialia | |||
40 | 2019 | A Single Process for Homogeneous and Heterogeneous Bonding in Flexible Electronics : Ethanol-Assisted Vacuum Ultraviolet (E-VUV) Irradiation Process | Yang T.H.; Yang C.Y.; Shigetou A.; C. ROBERT KAO | 2019 International Conference on Electronics Packaging | |||
41 | 2019 | Refine microstructure of solder materials via minor element additions | Chung C.K.; Yu J.J.; Yang T.L.; C. ROBERT KAO | 13th Electronic Circuits World Convention: Connecting the World | |||
42 | 2019 | Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications | Wang Y.W.; Shih W.L.; Hung H.T.; C. ROBERT KAO | Journal of Electronic Materials | |||
43 | 2019 | Bonding of Copper Pillars Using Electroless Cu Plating | Kao L.Y.; Hung H.T.; Chen Y.H.; C. ROBERT KAO | 2019 International Conference on Electronics Packaging | |||
44 | 2019 | Effects of Aspect Ratio on Microstructural Evolution of Ni/Sn/Ni Microjoints | Yang T.H.; Yu H.Y.; Wang Y.W.; C. ROBERT KAO | Journal of Electronic Materials | |||
45 | 2019 | Abnormal Cu3Sn growth through grain boundary penetration in space-confined Ni-Sn-Cu diffusion couples | Wang Y.W.; Zhu Z.X.; Shih W.L.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
46 | 2019 | Interfacial reactions of cu and in for low-temperature processes | Wang, Y.-W.; C. ROBERT KAO | 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019 | |||
47 | 2019 | Low temperature and pressureless microfluidic electroless bonding process for vertical interconnections | Hung H.-T.; Yang S.; Weng I.-A.; Chen Y.-H.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
48 | 2019 | Phase formation and microstructure evolution in Cu/In/Cu joints | Chiu Y.S.; Yu H.Y.; Hung H.T.; Wang Y.W.; C. ROBERT KAO | Microelectronics Reliability | |||
49 | 2019 | Effect of Ag concentration on small solder volume Ni/SnAg/Ni system | Yu J.J.; Yang S.; Chung C.K.; C. ROBERT KAO | 13th Electronic Circuits World Convention: Connecting the World | |||
50 | 2019 | Creep Behaviors Along Characteristic Crystal Orientations of Sn and Sn-1.8Ag by Using Nanoindentation | Chiang P.J.; Wu J.Y.; Yu H.Y.; C. ROBERT KAO | JOM | |||
51 | 2019 | Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration | Shigetou, A.; Yang, T.H.; C. ROBERT KAO | IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 | |||
52 | 2019 | Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface | Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO | Scientific Reports | 8 | ||
53 | 2019 | Mechanical reliability assessment of Cu6Sn5 intermetallic compound and multilayer structures in Cu/Sn interconnects for 3D IC applications | Wu J.-Y.; Kao C.R.; Yang J.-M.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
54 | 2019 | Mechanical characterizations of single-crystalline (Cu, Ni) 6 Sn 5 through uniaxial micro-compression | Wu J.Y.; Chiu Y.S.; Wang Y.W.; C. ROBERT KAO | Materials Science and Engineering A | |||
55 | 2019 | A single bonding process for diverse organic-inorganic integration in IoT devices | Yang T.H.; Chiu Y.-S.; Yu H.-Y.; Shigetou A.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
56 | 2018 | Organic/inorganic interfacial microstructures achieved by fast atom beam bombardment and vacuum ultraviolet irradiation | Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | |||
57 | 2018 | Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indium | Yang C.A.; Yang S.; Liu X.; Nishikawa H.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
58 | 2018 | Effects of plating conditions on electroless Ni-P plating in the microchannel | Yang C.-Y; Hung H.-T; Robert Kao C.; C. ROBERT KAO | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 | |||
59 | 2018 | Microstructure Evolution of Cu/In/Cu Joints after Solid-Liquid Interdiffusion | Chiu Y.S.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
60 | 2018 | Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications | Wang Y.W.; Yang T.L.; Wu J.Y.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
61 | 2018 | Creep mechanism in characteristic orientation of Sn and Sn-1.8Ag by nanoindentation | Chiang P.J.; Wu J.Y.; Liao Y.C.; C. ROBERT KAO | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | |||
62 | 2018 | Analyses and design for electrochemical migration suppression by alloying indium into silver | Yang C.A.; Wu J.; Lee C.C.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | |||
63 | 2018 | Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process | Yang S.; Hung H.-T.; Nishikawa H.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
64 | 2018 | High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications | Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
65 | 2018 | Bonding of copper pillars using electroless Au plating | Weng I.A.; Hung H.T.; Yang S.; Chen Y.H.; C. ROBERT KAO | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | |||
66 | 2018 | Materials merging mechanism of microfluidic electroless interconnection process | Yang S.; Hung H.T.; Wu P.Y.; Wang Y.W.; Nishikawa H.; C. ROBERT KAO | Journal of the Electrochemical Society | |||
67 | 2017 | Micromechanical behavior of single crystalline Ni 3 Sn 4 in micro joints for chip-stacking applications | Yu L.J.; Yen H.W.; Wu J.Y.; Yu J.J.; C. ROBERT KAO ; HUNG-WEI YEN | Materials Science and Engineering A | 10 | 10 | |
68 | 2017 | Grain Boundary Penetration of Various Types of Ni Layer by Molten Metals | Yang S.; Chang C.Y.; Zhu Z.X.; Lin Y.F.; C. ROBERT KAO | Journal of Electronic Materials | |||
69 | 2017 | Fast Atom Beam- and Vacuum-Ultraviolet-Activated Sites for Low-Temperature Hybrid Integration | Yang H.-W.; Kao C.R.; Shigetou A.; C. ROBERT KAO | Langmuir | |||
70 | 2017 | Micromechanical behavior of single-crystalline Cu 6 Sn 5 by picoindentation | Yu J.J.; Wu J.Y.; Yu L.J.; Yang H.W.; C. ROBERT KAO | Journal of Materials Science | |||
71 | 2017 | Critical Factors Affecting Structural Transformations in 3D IC Micro Joints | Yang H.W.; Yu H.Y.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
72 | 2017 | Contacts for PbTe | Li C.-C.; C. ROBERT KAO | Advanced Thermoelectrics: Materials, Contacts, Devices, and Systems | |||
73 | 2017 | Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro joints | Yang H.W.; Wu J.Y.; Zhu Z.X.; C. ROBERT KAO | Materials Chemistry and Physics | |||
74 | 2017 | Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint | Yang C.A.; Kao C.R.; Nishikawa H.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
75 | 2017 | Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating | Hung H.T.; Yang S.; Chen Y.B.; C. ROBERT KAO | Journal of Electronic Materials | |||
76 | 2016 | Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates - A simulation study | Ke J.H.; Gao Y.; Kao C.R.; Wang Y.; C. ROBERT KAO | Acta Materialia | |||
77 | 2016 | Full intermetallic joints for chip stacking by using thermal gradient bonding | Yang T.L.; Aoki T.; Matsumoto K.; Toriyama K.; Horibe A.; Mori H.; Orii Y.; Wu J.Y.; C. ROBERT KAO | Acta Materialia | |||
78 | 2016 | Choice of Intermetallic Compounds for Structural Applications in Near Submicron Joints | Yu J.J.; Wu J.Y.; Yu L.J.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
79 | 2016 | Low-temperature, pressureless Cu-to-Cu bonding by electroless Ni plating | Yang S.; Hung H.T.; Chen Y.B.; C. ROBERT KAO | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | |||
80 | 2016 | Novel Self-shrinking Mask for Sub-3 nm Pattern Fabrication | Yang P.-S.; Cheng P.-H.; Kao C.R.; C. ROBERT KAO ; MIIN-JANG CHEN | Scientific Reports | 9 | 12 | |
81 | 2016 | Au-Sn bonding material for the assembly of power integrated circuit module | Zhu Z.X.; Li C.C.; Liao L.L.; Liu C.K.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
82 | 2016 | Bonding of copper pillars using electroless Ni plating | Yang S.; Hung H.T.; Chen Y.B.; C. ROBERT KAO | 2016 International Conference on Electronics Packaging | |||
83 | 2016 | Morphological evolution induced by volume shrinkage in micro joints | Yang H.W.; C. ROBERT KAO | 2016 International Conference on Electronics Packaging | |||
84 | 2016 | Study of Sintered Nano-Silver Die Attachment Materials Doped with Indium | Yang C.A.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
85 | 2015 | Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique | Li C.C.; Hsu S.J.; Lee C.C.; Liao L.L.; Dai M.J.; Liu C.K.; Zhu Z.X.; Yang H.W.; Ke J.H.; Kao C.R.; Snyder G.J.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
86 | 2015 | Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration | Yang T.L.; Yu J.J.; Li C.C.; Lin Y.F.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
87 | 2015 | Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing | Li C.C.; Drymiotis F.; Liao L.L.; Dai M.J.; Liu C.K.; Chen C.L.; Chen Y.Y.; Kao C.R.; Snyder G.J.; C. ROBERT KAO | Energy Conversion and Management | |||
88 | 2015 | Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materials | Li C.C.; Drymiotis F.; Liao L.L.; Hung H.T.; Ke J.H.; Liu C.K.; Kao C.R.; Snyder G.J.; C. ROBERT KAO | Journal of Materials Chemistry C | |||
89 | 2015 | Mechanism of volume shrinkage during reaction between Ni and Ag-doped Sn | Li C.C.; Ke J.H.; Yang C.A.; C. ROBERT KAO | Materials Letters | |||
90 | 2015 | Low temperature bonding for high temperature applications by using SnBi solders | Yang T.L.; Wu J.Y.; Li C.C.; Yang S.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
91 | 2015 | Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications | Yu J.J.; Yang C.A.; Lin Y.F.; CHUN-HWAY HSUEH ; C. ROBERT KAO | Journal of Alloys and Compounds | |||
92 | 2015 | Interfacial Energy Effect on the Distribution of Ag3Sn in Full Intermetallic Joints | Yang T.-L.; Zhu Z.-X.; Yu J.-J.; Lin Y.-F.; C. ROBERT KAO | Advanced Engineering Materials | |||
93 | 2015 | In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro joints | Yu J.J.; Wu J.Y.; Yu L.J.; C. ROBERT KAO | 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference | |||
94 | 2015 | Effect of Ag concentration on Ni/Sn-xAg/Ni micro joints under space confinement | Yu J.J.; Wu J.Y.; Yang S.; C. ROBERT KAO | 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference | |||
95 | 2015 | Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping | Bashir M.N.; Haseeb A.S.M.A.; Rahman A.Z.M.S.; Fazal M.A.; C. ROBERT KAO | Journal of Materials Science | |||
96 | 2014 | Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing | Huang T.C.; Yang T.L.; Ke J.H.; Hsueh C.H.; CHUN-HWAY HSUEH ; C. ROBERT KAO | Scripta Materialia | 55 | 52 | |
97 | 2014 | Growth kinetics of Ag3Sn in silicon solar cells with a sintered Ag metallization layer | Yang T.L.; Huang K.Y.; Yang S.; Hsieh H.H.; C. ROBERT KAO | Solar Energy Materials and Solar Cells | 31 | 31 | |
98 | 2014 | Volume shrinkage induced by interfacial reaction in micro-Ni/Sn/Ni joints | Li C.C.; Chung C.K.; Shih W.L.; C. ROBERT KAO | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | 28 | 26 | |
99 | 2014 | Effects of silver addition on Cu-Sn microjoints for chip-stacking applications | Yang T.L.; Yu J.J.; Shih W.L.; CHUN-HWAY HSUEH ; C. ROBERT KAO | Journal of Alloys and Compounds | |||
100 | 2014 | Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications | Yang T.L.; Shih W.L.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
101 | 2014 | Phase field microelasticity model of dislocation climb: Methodology and applications | Ke J.H.; Boyne A.; Wang Y.; C. ROBERT KAO | Acta Materialia | |||
102 | 2014 | Inhibition of gold embrittlement in micro-joints for three-dimensional integrated circuits | Shih W.L.; Yang T.L.; Chuang H.Y.; Kuo M.S.; C. ROBERT KAO | Journal of Electronic Materials | |||
103 | 2014 | Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow | Key Chung C.; Zhu Z.X.; C. ROBERT KAO | Journal of Electronic Materials | |||
104 | 2014 | Amorphous Pd layer as a highly effective oxidation barrier for surface finish of electronic terminals | Li C.C.; Shih W.L.; Chung C.K.; C. ROBERT KAO | Corrosion Science | |||
105 | 2013 | Grain refinement of solder materials by minor element addition | Chung C.K.; Yu J.J.; Yang T.L.; C. ROBERT KAO | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | 5 | 0 | |
106 | 2013 | Serrated cathode dissolution under high current density: Morphology and root cause | Yang T.L.; Ke J.H.; Shih W.L.; Lai Y.S.; C. ROBERT KAO | Journal of Applied Physics | 6 | 6 | |
107 | 2013 | Volume shrinkage induced by interfacial reactions in micro joints | Li C.C.; Zhu Z.X.; Chen M.H.; C. ROBERT KAO | International Symposium on Advanced Packaging Materials | |||
108 | 2013 | Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics | Chen Y.J.; Chung C.K.; Yang C.R.; C. ROBERT KAO | Microelectronics Reliability | |||
109 | 2013 | Assembly of N type Bi2(Te, Se)3 thermoelectric modules by low temperature bonding | Li C.C.; Zhu Z.X.; Liao L.L.; Dai M.J.; Liu C.K.; C. ROBERT KAO | Science and Technology of Welding and Joining | |||
110 | 2013 | Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering process | Chung C.K.; Chen Y.J.; Yang T.L.; C. ROBERT KAO | Journal of Electronic Materials | 9 | 7 | |
111 | 2013 | Precipitation induced by diffusivity anisotropy in Sn grains under electron current stressing | Huang, T.C.; Yang, T.L.; Ke, J.H.; Li, C.C.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
112 | 2013 | Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D-IC applications | Yu J.J.; Chung C.K.; Yang S.; C. ROBERT KAO | International Symposium on Advanced Packaging Materials | |||
113 | 2013 | Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections | Chen Y.J.; Yang T.L.; Yu J.J.; Kao C.L.; C. ROBERT KAO | Materials Letters | 15 | 14 | |
114 | 2013 | Au and Pd embrittlement in space-confined soldering reactions for 3D IC applications | Chen Y.J.; Huang K.Y.; Chen H.T.; C. ROBERT KAO | International Symposium on Advanced Packaging Materials | |||
115 | 2013 | Reliability of micro-interconnects in 3D IC packages | Robert Kao, C.; Wu, Albert T.; Tu, King-Ning; Lai, Yi-Shao; C. ROBERT KAO | Microelectronics Reliability | |||
116 | 2013 | Interfacial reactions and electromigration in flip-chip solder joints | Ho C.E.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Advanced Flip Chip Packaging | |||
117 | 2013 | Cu(TiWNx) film as a barrierless buffer layer for metallization applications | Lin C.-H.; Chuang H.-Y.; C. ROBERT KAO | Japanese Journal of Applied Physics | |||
118 | 2012 | Origin and evolution of voids in electroless Ni during soldering reaction | Chung C.K.; Chen Y.J.; Chen W.M.; C. ROBERT KAO | Acta Materialia | 32 | 32 | |
119 | 2012 | Critical concerns in soldering reactions arising from space confinement in 3-D IC packages | Chuang H.Y.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; Li C.C.; C. ROBERT KAO | IEEE Transactions on Device and Materials Reliability | 82 | 73 | |
120 | 2012 | Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing | Ke, J.H.; Chuang, H.Y.; Shih, W.L.; C. ROBERT KAO | Acta Materialia | 67 | 67 | |
121 | 2012 | Soldering reactions under space confinement for 3D IC applications | Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | 10 | 0 | |
122 | 2012 | The critical oxide thickness for Pb-free reflow soldering on Cu substrate | Chung, C.Key; Chen, Y.J.; Li, C.C.; C. ROBERT KAO | Thin Solid Films | 26 | 23 | |
123 | 2012 | Elimination of voids in reactions between Ni and Sn: A novel effect of silver | Chuang, H.Y.; Yu, J.J.; Kuo, M.S.; Tong, H.M.; C. ROBERT KAO | Scripta Materialia | 79 | 76 | |
124 | 2012 | Effects of Ti addition to Sn–Ag and Sn–Cu solders | Chen, W.M.; Kang, S.K.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
125 | 2012 | Roles of phosphorous in Sn 4Ag 0.5Cu solder reaction with electrolytic Ni-Au | Key Chung C.; Huang T.C.; Shia R.; Yang T.L.; C. ROBERT KAO | Journal of Alloys and Compounds | 7 | 9 | |
126 | 2012 | Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium | Chen W.M.; Kang S.K.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
127 | 2011 | The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction | Chen W.M.; Yang T.L.; Chung C.K.; C. ROBERT KAO | Scripta Materialia | 31 | 31 | |
128 | 2011 | Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder | Chang, C. C.; Yang, S. C.; Chen, Y. J.; C. ROBERT KAO ; CHIEN-CHENG CHANG | International Journal of Materials Research | 0 | 1 | |
129 | 2011 | Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding | Chen, Jiunn ; Lai, Yi-Shao; Wang, Yi-Wun; C. ROBERT KAO | Microelectronics Reliability | 50 | 42 | |
130 | 2011 | Laminar pattern induced by cycling thermomechanical stress in two-phase materials | Chang, C.C.; Chen, Y.J.; Tsai, M.Y.; C. ROBERT KAO ; CHIEN-CHENG CHANG | Materials Chemistry and Physics | 0 | 0 | |
131 | 2011 | Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing | Ke J.H.; Yang T.L.; Lai Y.S.; C. ROBERT KAO | Acta Materialia | 54 | 52 | |
132 | 2011 | Experimental Evidence for Formation of Ni-Al Compound in Flip-Chip Joints Under Current Stressing | Tsai, M.Y.; Lin, Y.L.; Tsai, M.H.; Chen, Y.J.; C. ROBERT KAO | Journal of ELECTRONIC MATERIALS | 1 | 1 | |
133 | 2011 | Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints | Liu, Chao Sheng; Ho, Cheng En; Peng, Cheng Sam; C. ROBERT KAO | Journal of electronic materials | 32 | 28 | |
134 | 2011 | Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging | Chuang H.Y.; Chen W.M.; Shih W.L.; Lai Y.S.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
135 | 2011 | Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding | Lu Y.H.; Wang Y.W.; Appelt B.K.; Lai Y.S.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
136 | 2010 | Temperature effects on electromigration behavior of solder joints | Ke J.-H.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | |||
137 | 2010 | Oxidation behavior of ENIG and ENEPIG surface finish | Lee C.C.; Chuang H.Y.; Chung C.K.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | |||
138 | 2010 | Direct evidence for a Cu-enriched region at the boundary between Cu6Sn5 and Cu3Sn during Cu/Sn reaction | Chung, C.Key; Duh, Jenq-Gong; C. ROBERT KAO | Scripta Materialia | 46 | 44 | |
139 | 2010 | Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints | CHIEN-CHENG CHANG ; Wang, Y.W.; Lai, Y.S.; C. ROBERT KAO | Journal of electronic materials | 8 | 7 | |
140 | 2010 | Uncovering the driving force for massive spalling in the Sn-Cu/Ni system | Chen, W.M.; Yang, S.C.; Tsai, M.H.; C. ROBERT KAO | Scripta Materialia | 27 | 25 | |
141 | 2010 | Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer | CHIEN-CHENG CHANG ; Chung, H.Y.; Lai, Y.S.; C. ROBERT KAO | Journal of electronic materials | 9 | 7 | |
142 | 2010 | Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints | Tsai, M.Y.; Lin, Y.L.; Lin, Y.W.; Ke, J.H.; C. ROBERT KAO | Journal of electronic materials | 2 | 2 | |
143 | 2010 | Study of UBM consumption in flip chip solder joints under varied extra-high current density with local temperature control | Yang T.L.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | 0 | 0 | |
144 | 2010 | The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering | Lin, Y.W.; Wang, Y.W.; C. ROBERT KAO ; CHIEN-CHENG CHANG | Journal of Alloys and Compounds | |||
145 | 2010 | Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn-Zn systems | Tsai, M.Y.; Yang, S.C.; Wang, Y.W.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
146 | 2010 | Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders | Wang, Y.W.; Lin, Y.W.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
147 | 2010 | Novel Cu-RuNx composite layer with good solderability and very low consumption rate | Chuang, H.Y.; Lin, C.H.; Chu, J.P.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
148 | 2010 | Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni | Yang, S.C.; Chang, C.C. ; Tsai, M.H.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
149 | 2010 | Effects of Ni Additions on the Growth of Cu3Sn in High-Lead Solders | Wang, Y.W.; CHIEN-CHENG CHANG ; Chen, W.M.; C. ROBERT KAO | Journal of Electronic Materials | 7 | 7 | |
150 | 2010 | Spectacular epitaxial growth of (Cu,Ni)6Sn5 formed on Ni substrate | Chen W.M.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | |||
151 | 2010 | Electromigration in flip chip solder joints under extra high current density | Lin, Y.W.; Ke, J.H.; Chuang, H.Y.; Lai, Y.S.; C. ROBERT KAO | Journal of Applied Physics | 23 | 23 | |
152 | 2010 | Sn concentration effect on the formation of intermetallic compounds in high-Pb/Ni reactions | Tsai, M.H.; Chen, W.M.; Tsai, M.Y.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
153 | 2010 | Cross-interaction between Ni and Cu across a high-lead solder joint with different solder volume | Chang C.C.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | |||
154 | 2009 | Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder joints | Tsai M.-Y.; Lin Y.-L.; C. ROBERT KAO | IMPACT Conference 2009 International 3D IC Conference | |||
155 | 2009 | Interfacial reaction and the dominant diffusing species in Mg-Ni system | Tsai M.Y.; Chou M.H.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
156 | 2009 | Development of lead-free solders with superior drop test reliability performance | Wang Y.W.; C. ROBERT KAO | 2009 International Conference on Electronic Packaging Technology and High Density Packaging | |||
157 | 2009 | Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu | Wang Y.W.; Lin Y.W.; Tu C.T.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
158 | 2009 | Effects of Ni addition to high-lead solders on the growth of Cu 3Sn and micro voids | Wang Y.W.; C. ROBERT KAO | IMPACT Conference 2009 International 3D IC Conference | |||
159 | 2009 | Effect of multiple reflow cycles on ball impact responses of SnAgCu solder joints | Lai Y.; Chang H.; Kao C.; C. ROBERT KAO | Soldering & Surface Mount Technology | |||
160 | 2009 | Journal of Electronic Materials: Foreword | Kang S.K.; Anderson I.; Chada S.; Duh J.-G.; Turbini L.J.; Wu A.; C. ROBERT KAO ; Hua F.; Subramanian K.N.; Frear D.; Handwerker C.; Guo F.; Chawla N.; Zeng, Kejun | Journal of Electronic Materials | 2 | 0 | |
161 | 2009 | Interfacial reaction and wetting behavior between Pt and molten solder | Yang S.C.; Chang W.C.; Wang Y.W.; C. ROBERT KAO | Journal of Electronic Materials | 14 | 17 | |
162 | 2009 | Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substrates | CHIEN-CHENG CHANG ; Lin Y.W.; Lai Y.S.; C. ROBERT KAO | Journal of Electronic Materials | 6 | 5 | |
163 | 2009 | Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth | Wang Y.W.; Chang C.C. ; C. ROBERT KAO | Journal of Alloys and Compounds | |||
164 | 2009 | Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates | Wang Y.W.; Lin Y.W.; C. ROBERT KAO | Microelectronics Reliability | |||
165 | 2009 | Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate | Tsai M.H.; Lin Y.W.; Chuang H.Y.; C. ROBERT KAO | Journal of Materials Research | |||
166 | 2009 | Fundamental study of 95 high-lead solder bump on substrates pre-soldered with eutectic PbSn | Chang C.-C.; Lin C.-C.; C. ROBERT KAO | IMPACT Conference 2009 International 3D IC Conference | |||
167 | 2009 | Effects of Cu content on the dissolution rate of Cu for real solder joint during reflow soldering | Chang C.-C.; C. ROBERT KAO | IMPACT Conference 2009 International 3D IC Conference | |||
168 | 2008 | 電遷移對覆晶元件銲點之影響(3/3) | 高振宏 | ||||
169 | 2008 | 物質跨越微電子銲點進行交互作用之尖端研究 (新制多年期第2年) | 高振宏 | ||||
170 | 2008 | 物質跨越微電子銲點進行交互作用之尖端研究 (新制多年期第1年) | 高振宏 | ||||
171 | 2008 | Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finish | Lail Y.-S.; Kao C.R.; Chang H.-C.; Lee S.-H.; Kao C.-L.; Lan W.-H.; C. ROBERT KAO | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference | |||
172 | 2008 | Microstructure study of high lead bump FCBGA bending test | Hung L.Y.; Chang P.H.; Chang C.C.; Wang Y.P.; Hsiao C.S.; C. ROBERT KAO | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference | |||
173 | 2008 | Lead-free and lead-bearing electronic solders: Implementation, reliability, and new technology | C. ROBERT KAO | JOM | |||
174 | 2008 | Lead-Free and Lead-Bearing Electronic Solders: Implementation, Reliability, and New Technology | Kao, C. Robert | JOM | |||
175 | 2008 | Tin whisker growth induced by high electron current density | Lin Y.W.; Lai Y.-S.; Lin Y.L.; Tu C.-T.; C. ROBERT KAO | Journal of Electronic Materials | |||
176 | 2008 | Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration | Lin Y.L.; Lai Y.S.; Lin Y.W.; C. ROBERT KAO | Journal of Electronic Materials | |||
177 | 2008 | Minor Fe, Co, and Ni additions to SnAgCu solders for retarding CU3Sn growth | Wang Y.W.; C. ROBERT KAO | 2008 10th International Conference on Electronic Materials and Packaging | |||
178 | 2008 | Analysis and experimental verification of the volume effect in the reaction between zn-doped solders and cu | Yang S.C.; Wang Y.W.; CHIEN-CHENG CHANG ; C. ROBERT KAO | Journal of Electronic Materials | 18 | 18 | |
179 | 2008 | Pronounced electromigration of Cu in molten Sn-based solders | Huang J.R.; Tsai C.M.; Lin Y.W.; C. ROBERT KAO | Journal of Materials Research | |||
180 | 2007 | Effect of Zn addition on the interfacial reactions between Cu and lead-free solders | Yang S.-C.; Ho C.-E.; Chang C.-W.; C. ROBERT KAO | Materials Research Society Symposium | |||
181 | 2007 | Interfacial reaction issues for lead-free electronic solders | Ho C.E.; Yang S.C.; C. ROBERT KAO | Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics | |||
182 | 2007 | Dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders | Chang C.C.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | |||
183 | 2007 | Interfacial reaction issues for lead-free electronic solders | Ho C.E.; Yang S.C.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | |||
184 | 2007 | Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness | Chang, Chien Wei; Yang, Su Chun; Tu, Chun-Te; Kao, C. Robert | Journal of Electronic Materials | |||
185 | 2007 | Tin whisker growth induced by high electron current density | Lin Y.W.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | |||
186 | 2007 | Role of minor Zn addition in the interfacial reaction between lead-free solders and Cu | Yang S.C.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | |||
187 | 2007 | Massive spalling of intermetallics in solder joints: A general phenomenon that can occur in multiple solder-substrate systems | Yang S.C.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
188 | 2007 | Massive spalling of intermetallic compound in lead-free solder joints | Yang S.-C.; Ho C.-E.; Chang C.-W.; C. ROBERT KAO | Materials Research Society Symposium | |||
189 | 2007 | Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element | Yang S.C.; Ho C.E.; Chang C.W.; C. ROBERT KAO | Journal of Applied Physics | |||
190 | 2007 | Cross-interaction between Ni and Cu across Sn layers with different thickness | Chang, C.W.; Yang, S.C.; Tu, C.-T.; C. ROBERT KAO | Journal of Electronic Materials | |||
191 | 2007 | The effects of minor Fe, Co, and Ni additions to lead-free solders on the thickness of Cu3Sn at the interface | Wang Y.W.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | |||
192 | 2006 | 化學工程與材料工程 | 高振宏 | 化工技術 | |||
193 | 2006 | SnAgCu系列無鉛銲料應用於先進微電子封裝之研究 | 高振宏 ; 楊素純 | 工程科技通訊 | |||
194 | 2006 | Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints | Lin Y.L.; Chang C.W.; Tsai C.M.; Lee C.W.; C. ROBERT KAO | Journal of Electronic Materials | 45 | 43 | |
195 | 2006 | Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates | Tsai J.Y.; Chang C.W.; Ho C.E.; Lin Y.L.; C. ROBERT KAO | Journal of Electronic Materials | 40 | 34 | |
196 | 2006 | Effects of limited Cu supply on soldering reactions between SnAgCu and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 138 | 116 | |
197 | 2006 | Kinetics of AuSn 4 migration in lead-free solders | Chang C.W.; Ho C.E.; Yang S.C.; C. ROBERT KAO | Journal of Electronic Materials | 23 | 20 | |
198 | 2006 | Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples | Chang C.W.; Lee Q.P.; Ho C.E.; C. ROBERT KAO | Journal of Electronic Materials | 24 | 23 | |
199 | 2006 | Journal of Electronic Materials: Foreword | Chawla N.; Chada S.; Kang S.K.; C. ROBERT KAO ; Lin K.-L.; Lucas J.; Turbini L. | Journal of Electronic Materials | 2 | 0 | |
200 | 2006 | Journal of Electronic Materials: Foreword | Suganuma K.; Chen S.-W.; Kao C.R.; Lee H.M.; Swenson D.J.; C. ROBERT KAO | Journal of Electronic Materials | 0 | 0 | |
201 | 2006 | Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration | Lin Y.L.; Lai Y.S.; Tsai C.M.; C. ROBERT KAO | Journal of Electronic Materials | 31 | 27 | |
202 | 2006 | In-situ observation of material migration in flip-chip solder joints under current stressing | Tsai C.M.; Lai Y.-S.; Lin Y.L.; Chang C.W.; C. ROBERT KAO | Journal of Electronic Materials | |||
203 | 2006 | Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu | Yang S.C.; Ho C.E.; Chang C.W.; C. ROBERT KAO | Journal of Materials Research | |||
204 | 2006 | Special issue papers: Phase stability, phase transformations, and reactive phase formation in electronics materials IV - Foreword | Chen, S. W.; Kao, C. R.; Lee, H. M.; Mohney, S.; Suganuma, K.; Swenson, D. J.; Chada, S.; C. ROBERT KAO | Journal of Electronic Materials | 1 | ||
205 | 2006 | Local melting induced by electromigration in flip-chip solder joints | Tsai C.M.; Lin Y.L.; Tsai J.Y.; Lai Y.I.-S.; C. ROBERT KAO | Journal of Electronic Materials | 61 | 58 | |
206 | 2005 | Electromigration-induced grain rotation in anisotropic conducting beta tin | Wu A.T.; Gusak A.M.; Tu K.N.; C. ROBERT KAO | Applied Physics Letters | |||
207 | 2005 | Volume effect on the soldering reaction between SnAgCu solders and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; C. ROBERT KAO | International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces | |||
208 | 2005 | Electromigration induced metal dissolution in flip-chip solder joints | Lin, Y. H.; Tsai, C. M.; Hu, Y. C.; Lin, Y. L.; Tsai, J. Y.; Kao, C. R.; C. ROBERT KAO | Pricm 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing, Pts 1-5 | |||
209 | 2005 | Controlling the microstructures from the gold-tin reaction | Tsai J.Y.; Chang C.W.; Shieh Y.C.; Hu Y.C.; C. ROBERT KAO | Journal of Electronic Materials | |||
210 | 2005 | Electromigration-induced failure in flip-chip solder joints | Lin Y.H.; Tsai C.M.; Hu Y.C.; Lin Y.L.; C. ROBERT KAO | Journal of Electronic Materials | 100 | 90 | |
211 | 2005 | Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations | Luo W.C.; Ho C.E.; Tsai J.Y.; Lin Y.L.; C. ROBERT KAO | Materials Science and Engineering A | |||
212 | 2005 | In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing | Lin Y.H.; Hu Y.C.; Tsai C.M.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Acta Materialia | |||
213 | 2005 | Electromigration induced metal dissolution in flip-chip solder joints | Lin Y.H.; Tsai C.M.; Hu Y.C.; Lin Y.L.; Tsai J.Y.; C. ROBERT KAO | Materials Science Forum | |||
214 | 2005 | Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton | Wu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Materials Research Society Symposium | |||
215 | 2004 | 先進微電子封裝中錫銀銅銲料與金/鎳 表面處理層之界面反應 | 羅偉誠 ; 蕭麗娟; 何政恩; 高振宏 | Journal of the Chinese Colloid & Interface Science | |||
216 | 2004 | Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints | Tsai C.M.; Luo W.C.; Chang C.W.; Shieh Y.C.; C. ROBERT KAO | Journal of Electronic Materials | 63 | 57 | |
217 | 2004 | Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints | Lin Y.L.; Luo W.C.; Lin Y.H.; Ho C.E.; C. ROBERT KAO | Journal of Electronic Materials | 17 | 16 | |
218 | 2004 | Special issue on Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials III - Foreword | Kao, C. R.; Chen, S. W.; Lee, H. M.; Mohney, S. E.; Notis, M. R.; Swenson, D. J.; C. ROBERT KAO | Journal of Electronic Materials | 0 | ||
219 | 2004 | Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction | Wu A.T.; Tu K.N.; Lloyd J.R.; Tamura N.; Valek B.C.; C. ROBERT KAO | Applied Physics Letters | |||
220 | 2003 | 大學化工熱力學課程發展之回顧 | 高振宏 | 化工 | |||
221 | 2003 | SEM/EDS的原理與操作應用之簡介半導體工業構裝材料 | 何政恩; 高振宏 | 化工技術 | |||
222 | 2003 | 純物質織成核熱力學及動力學簡介 | 蔡家銘; 高振宏 | 化工技術 | |||
223 | 2003 | 錫銀銅銲料與鎳層反應時銅濃度效應之探討 | 羅偉誠 ; 胡應強; 何政恩; 高振宏 | Welding and Cutting | |||
224 | 2003 | Recent progress in phase diagram calculation and application | C. ROBERT KAO | JOM | 1 | 1 | |
225 | 2003 | Electromigration failure in flip chip solder joints due to rapid dissolution of copper | Hu Y.C.; Lin Y.H.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Journal of Materials Research | |||
226 | 2003 | Chemical reaction in solder joints of microelectronic packages | Ho C.E.; Lin Y.L.; Tsai J.Y.; C. ROBERT KAO | Journal of the Chinese Institute of Chemical Engineers | |||
227 | 2003 | Foreword | Chen S.-W.; Lee H.M.; Swenson D.; C. ROBERT KAO ; Mohney S.E.; Notis M.R. | Journal of Electronic Materials | 0 | 0 | |
228 | 2003 | Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword | Lucas, J. P.; Chada, S.; Kang, S. K.; Kao, C. R.; Lin, K. L.; Ready, J.; Yu, J.; C. ROBERT KAO | Journal of Electronic Materials | 1 | ||
229 | 2003 | A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni | Tsai J.Y.; Hu Y.C.; Tsai C.M.; C. ROBERT KAO | Journal of Electronic Materials | |||
230 | 2002 | 構裝接點面面觀-鉍錫無鉛銲料系統 | 胡應強; 陳琪; 徐敏雯; 高振宏 | 工業材料雜誌 | |||
231 | 2002 | 抑制易脆之Au介金屬於微電子封裝銲點中生成之方法 | 何政恩; 高振宏 | 知識創新 | |||
232 | 2002 | 先進封裝技術中金脆效應對銲點影響之探討 | 何政恩; 蕭麗娟; 高振宏 | 電子與材料 | |||
233 | 2002 | Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages | Shiau L.C.; Ho C.E.; C. ROBERT KAO | Soldering and Surface Mount Technology | 110 | 101 | |
234 | 2002 | Phase diagrams of important electronic materials | C. ROBERT KAO | JOM | 5 | 5 | |
235 | 2002 | New failure mode induced by electric current in flip chip solder joint | Lin Y.H.; Hu Y.C.; Tsai J.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging 2002 | |||
236 | 2002 | Electromigration in tin thin film | Hu Y.C.; Wan S.W.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging | |||
237 | 2002 | Foreword | Chada S.; Frear D.; Jin S.; Kang S.K.; C. ROBERT KAO ; Weiser, Martin | Journal of Electronic Materials | 4 | 1 | |
238 | 2002 | Inhibiting the formation of (Au1-xNix)Sn4 and reducing the consumption of Ni metallization in solder joints | Ho C.E.; Shiau L.C.; C. ROBERT KAO | Journal of Electronic Materials | |||
239 | 2002 | Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders | Chen W.T.; Ho C.E.; C. ROBERT KAO | Journal of Materials Research | 216 | 193 | |
240 | 2002 | Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish | Luo W.-C.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging 2002 | |||
241 | 2002 | Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages | Lin Y.L.; Tsai J.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging 2002 | |||
242 | 2002 | The effect of Ni on the interfacial reaction between Sn-Ag solder and Cu metallization | Tsai J.Y.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging | |||
243 | 2002 | Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni | Ho C.E.; Lin Y.L.; C. ROBERT KAO | Chemistry of Materials | 77 | 73 | |
244 | 2002 | Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni | Ho C.E.; Tsai R.Y.; Lin Y.L.; C. ROBERT KAO | Journal of Electronic Materials | |||
245 | 2001 | Foreword | Kang S.K.; Mavoori H.; Chada S.; C. ROBERT KAO ; Smith R.W. | Journal of Electronic Materials | 10 | 6 | |
246 | 2001 | Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering | Ho C.E.; Tsai S.Y.; C. ROBERT KAO | IEEE Transactions on Advanced Packaging | |||
247 | 2001 | Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish | Liu C.M.; Ho C.E.; Chen W.T.; C. ROBERT KAO | Journal of Electronic Materials | |||
248 | 2001 | Selective interfacial reaction between Ni and eutectic BiSn lead-free solder | Tao W.H.; Chen C.; Ho C.E.; Chen W.T.; C. ROBERT KAO | Chemistry of Materials | |||
249 | 2001 | Interactions between solder and metallization during long-term aging of advanced microelectronic packages | Ho C.E.; Chen W.T.; C. ROBERT KAO | Journal of Electronic Materials | |||
250 | 2000 | 鎳與微電子用鉍錫銲料反應之研究 | 高振宏 | 工程科技通訊 | |||
251 | 2000 | Using tert-butyl alcohol as an adductive agent for separation of an m-cresol and 2,6-xylenol mixture | Lee, L. S.; Lin, C. W.; Kao, C. H.; C. ROBERT KAO | Industrial & Engineering Chemistry Research | 17 | ||
252 | 2000 | Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish | Ho C.E.; Zheng R.; Luo G.L.; Lin A.H.; C. ROBERT KAO | Journal of Electronic Materials | |||
253 | 2000 | Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate | Chen C.; Ho C.E.; Lin A.H.; Luo G.L.; C. ROBERT KAO | Journal of Electronic Materials | |||
254 | 2000 | Optimizing the wire-bonding parameters for second bonds in ball grid array packages | Ho C.E.; Chen C.; C. ROBERT KAO | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers, Series A/Chung-kuo Kung Ch'eng Hsuch K'an |